- •Contents
- •List of tables
- •List of figures
- •1 Introduction
- •2 Description
- •2.1 Device overview
- •2.2 Overview
- •2.3 Embedded Flash memory
- •2.4 CRC (cyclic redundancy check) calculation unit
- •2.5 Embedded SRAM
- •2.6 Nested vectored interrupt controller (NVIC)
- •2.7 External interrupt/event controller (EXTI)
- •2.8 Clocks and startup
- •2.9 Boot modes
- •2.10 Power supply schemes
- •2.11 Power supply supervisor
- •2.12 Voltage regulator
- •2.16 Timers and watchdogs
- •2.16.3 Basic timers TIM6 and TIM7
- •2.16.4 Independent watchdog
- •2.16.5 Window watchdog
- •2.16.6 SysTick timer
- •2.18 Universal synchronous/asynchronous receiver transmitter (USART)
- •2.19 Serial peripheral interface (SPI)
- •2.22 Remap capability
- •2.25 Temperature sensor
- •3 Pinouts and pin description
- •4 Memory mapping
- •5 Electrical characteristics
- •5.1 Parameter conditions
- •5.1.1 Minimum and maximum values
- •5.1.2 Typical values
- •5.1.3 Typical curves
- •5.1.4 Loading capacitor
- •5.1.5 Pin input voltage
- •5.1.6 Power supply scheme
- •5.1.7 Current consumption measurement
- •5.2 Absolute maximum ratings
- •5.3 Operating conditions
- •5.3.1 General operating conditions
- •5.3.2 Operating conditions at power-up / power-down
- •5.3.3 Embedded reset and power control block characteristics
- •5.3.4 Embedded reference voltage
- •5.3.5 Supply current characteristics
- •5.3.6 External clock source characteristics
- •5.3.7 Internal clock source characteristics
- •5.3.8 PLL characteristics
- •5.3.9 Memory characteristics
- •5.3.10 EMC characteristics
- •5.3.11 Absolute maximum ratings (electrical sensitivity)
- •5.3.12 I/O port characteristics
- •5.3.13 NRST pin characteristics
- •5.3.14 TIMx characteristics
- •5.3.15 Communications interfaces
- •5.3.17 DAC electrical specifications
- •5.3.18 Temperature sensor characteristics
- •6 Package characteristics
- •6.1 Package mechanical data
- •6.2 Thermal characteristics
- •6.2.1 Reference document
- •6.2.2 Selecting the product temperature range
- •7 Ordering information scheme
- •8 Revision history
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB |
Electrical characteristics |
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5.1.7Current consumption measurement
Figure 11. Current consumption measurement scheme
IDD_VBAT
VBAT
IDD
VDD |
VDDA
ai14126
5.2Absolute maximum ratings
Stresses above the absolute maximum ratings listed in Table 5: Voltage characteristics,
Table 6: Current characteristics, and Table 7: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Table 5. |
Voltage characteristics |
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Ratings |
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Min |
Max |
Unit |
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VDD VSS |
External main supply voltage (including |
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–0.3 |
4.0 |
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V |
DDA |
and V |
)(1) |
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DD |
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V |
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VIN |
Input voltage on five volt tolerant pin(2) |
VSS 0.3 |
+5.5 |
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Input voltage on any other pin(2) |
V |
SS |
0.3 |
V +0.3 |
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DD |
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| VDDx| |
Variations between different VDD power pins |
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50 |
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|VSSX VSS| |
Variations between all the different ground |
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50 |
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pins |
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Electrostatic discharge voltage (human body |
see Section 5.3.11: Absolute |
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VESD(HBM) |
model) |
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maximum ratings (electrical |
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sensitivity) |
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1.All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range.
2.IINJ(PIN) must never be exceeded (see Table 6: Current characteristics). This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN> VINmax while a negative injection is induced by VIN<VSS.
Doc ID 16455 Rev 3 |
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