Списокиспользованныхисточников
1.
Tech-Sheet: Solder Paste Handling Guidelines/AIM. www.aimsolder.com
2. The
Quick Pocket Reference For Solder Assembly/AIM. www.aimsolder.com
3. User‘s
guidelines for Cobar No-Clean Solder Paste SnPb X-Series/Cobar Europe
BV – 2003. www.cobar.com
4. Application
Note: Procedures for Handling Solder Paste/Indium Corp.
www.indium.com
5.
Multicore Solders. Solder Paste Handling Guidelines/Henkel Loctite
Adhesives Ltd. – 2004. www.loctite.com
6. Ray P.
Prasad. Surface Mount Technology – Principles and Practice. 2nd
ed. Kluwer Academic Publishers, Boston, USA, 2002. – 772
p.
7.
IPC-TM-650. Test Methods Manual. Online-версия.www.ipc.org
8. IPC/EIA
J-STD-005. Requirements for Soldering Pastes, Includes Amendment 1 –
1995. webvision.ipc.org
9. IPC/EIA
J-STD-004. Requirements for Soldering Fluxes –
2004.webvision.ipc.org
10. Материалы фирмы
AIM. www.aimsolder.com
11. Материалы фирмы
Kester. www.kester.com
12. Материалы фирмы
Cobar. www.cobar.com
13. Материалы фирмы
Loctite. www.loctite.com
14. Материалы фирмы
Indium. www.indium.com
15. Материалы фирмы
MalcomTech. www.malcomtech.com
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