IPC publications catalog 2003-2004.Electronics assembly

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G E N E R A L

IPC-T-50F

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

ANSI Approved. This standard provides descriptions and illustrations to help users and their customers speak the same language. Also included is a section on acronyms and an index of terms by technology types. Revision G coming soon—check the online store. 70 pages. Revised July 1996.

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IPC-S-100

Standards and Specifications Manual*

The most complete compilation of IPC specifications is now available in hard copy and on CD-ROM. IPC-S-100 covers all aspects of electronic interconnection technology, from design through assembly and test and includes the latest standards. If you're just starting out, implementing a new procedure or considering a change from military standards, this is the most comprehensive reference set available. Over 50 documents included. Two years of updating (subscription) service is included with this manual. Save 60% by not purchasing documents individually.

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IPC-HDBK-610

Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison)

ANSI Approved. Includes IPC-A-610C Amendment 1, as well as a comprehensive cross-reference and comparison of Revisions B and C with each change explained. IPC-A-610C provides visual support to assist with understanding the electronic assembly requirements. This handbook offers explanatory and tutorial information to help with the implementation of the requirements of IPC-A-610 versions B or C. There are five appendices with a comprehensive comparison of the changes between versions B and C of the standard, explanation of minimum electrical clearance, metric conversion, the U.S. Department of Defense Adoption Notice and Amendment 1

to the standard. 115 pages. Released September 2002. See IPC-EA-100K below.

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IPC-EA-100-K

Electronic Assembly Reference Set

Your complete source for the most important electronic assembly documents in both hard and electronic copies: IPC/EIA J-STD-001C, IPC-HDBK-001, IPC-A-610C and IPC-HDBK-610.

This handy, "at-your-fingertips" reference set even includes high resolution color pictures in IPC-A- 610C, IPC/EIA J-STD-001C and black and white pictures in the handbooks. To facilitate electronic searching of requirements, you also get singleuser (print screen only) .pdf copies of all four documents on CD. Plus, you save 40% over the cost of individual documents.

SET:

IPC members: $220.00

Nonmembers: $440.00

www.ipc.org/onlinestore

IPC/EIA J-STD-028

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, nonmelting stand-offs and conductive polymer deposits. The document articulates a set of designations and expectations for product performance for the manufacturer and the user of flip chip or chip scale devices. Recommendations are provided to implement the best commercial practices and evolving process improvements. Developed by IPC and EIA. 36 Pages. Released August 1999.

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SMC-WP-003

Chip Mounting Technology

Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. The most commonly used substrate options of laminate, ceramic and silicon are also reviewed. 33 pages. This document is ONLY available through FREE download at the online store. Released by the Surface Mount Council, August 1993.

J-STD-013

Implementation of Ball Grid Array and Other High Density Technology

ANSI Approved. This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-user environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996.

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Equivalent to IEC/PAS 62085:

HARD COPY:

IPC members: $110.00

Nonmembers: $220.00

IPC-7095

Design and Assembly Process Implementation for BGAs

ANSI Approved. Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGAs. The effect of BGA and FBGA on current technology and component types is also discussed. 77 pages. Released August 2000. Revision A coming soon—check the online store.

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IPC/EIA J-STD-032

Performance Standard for Ball Grid Array Balls

This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002.

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IT-98000

JPL Chip Scale Packaging Guidelines

This ITRI report describes the step-by-step process used by the Jet Propulsion Laboratory, California Institute of Technology Lead Microtype BGA consortium to select the packages, design test vehicles and conduct evaluations on 11 Micro BGAs and CSPs assembled on conventional and microvia PCBs. Not available in electronic format. 148 pages. Released January 2000.

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IPC members: $495.00

Nonmembers: $990.00

IT-98080

JPL Ball Grid Array Packaging Guidelines

The Jet Propulsion Laboratory, California Institute of Technology (JPL) assembled a group of organizations to investigate the use of Ball Grid Array (BGA) packaging for spaceflight applications. This ITRI report details this evaluation of BGA technology, including robustness, quality and reliability factors through a DOE test matrix. Not available in electronic format. 90 pages. Released August 1998.

HARD COPY:

IPC members: $250.00

Nonmembers: $500.00

IT-98093

ITRI Chip Carrier, Phase 1 Report

The first comprehensive analysis of U.S. fabricators' ability to manufacture high density silicon chip carriers was produced by ITRI. It encourages U.S. PCB fabricators to consider new business opportunities due to the ever-improving performance of ICs and hand held and portable electronics: specifically using PCBs as substrates for single chip packaging and direct chip attach. Not available in electronic format. 93 pages. Released September 1998.

HARD COPY:

IPC members: $495.00

Nonmembers: $990.00

IPC-MC-790

Guidelines for Multichip Module Technology Utilization

Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

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IPC-M-108

Cleaning Guides and Handbooks Manual*

This convenient set of seven documents includes the latest editions of IPC cleaning guides and handbooks. It assists manufacturing engineers when making decisions on cleaning products and processes and provides guidance for troubleshooting. Save 50% by not purchasing documents individually.

IPC-TP-1113

Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?

This technical paper by Dr. Jack Brous discusses ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of noclean fluxes. 8 pages. Released 1994.

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IPC-CH-65A

Guidelines for Cleaning of Printed Boards and Assemblies

ANSI Approved. A road map for current and emerging cleaning issues in the electronics industry, this handbook includes description and discussion of various cleaning methods. It explains the relationship between materials, processes and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. 56 pages. Revised August 1999.

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IPC-SC-60A

Post Solder Solvent Cleaning Handbook ANSI Approved. This handbook addresses the use of solvent cleaning technology in automated and manual soldering operations. It serves as a selection guide for cleaning solvents and equipment by discussing properties of solvents, residues, considerations on process control and environmental issues. 40 pages. Released

August 1999.

HARD COPY: CD or DOWNLOAD:

IPC-SA-61A

Post Solder Semi-Aqueous Cleaning Handbook

Covers aspects of semi-aqueous cleaning such as chemicals, manufacturing residues, equipment and processes, process control, environmental considerations and safety. Enhancements in this revision include a separate discussion of watersoluble and water-insoluble cleaning agents and expanded process and quality control. 32 pages. Released June 2002.

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IPC-AC-62A

Aqueous Post Solder Cleaning Handbook ANSI Approved. Describes manufacturing residues, types and properties of aqueous cleaning agents, aqueous cleaning processes and equipment, process and quality control, environmental controls and considerations, worker safety, cleanliness determination, measurement and cost. 75 pages. Revised January 1996.

HARD COPY: CD or DOWNLOAD:

IPC-TR-476A

Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies

This technical report provides information on an IPC program designed to identify/evaluate electromigration on PCBs. The theory of electrochemical migration and the test procedures needed to assess the susceptibility are discussed. The results of a literature review survey are included. Not available in electronic format. 14 pages. Revised 1997.

HARD COPY:

IPC members: $30.00

Nonmembers: $60.00

IPC-TR-580

Cleaning and Cleanliness Test Program, Phase 1 Test Results

A joint test program sponsored by EPA, DOD and IPC was developed to evaluate alternatives that reduce the level of CFCs used in electronics manufacturing cleaning processes. The results of the test program's first phase are presented in this report. Not available in electronic format. 110 pages. Released October 1989.

HARD COPY:

IPC members: $35.00

Nonmembers: $70.00

UPDATED IPC/JEDEC J-STD-033A

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

ANSI Approved. Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags. Developed by IPC and JEDEC. 12 pages. Released July 2002.

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IPC/JEDEC J-STD-035

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. Equivalent to IEC/PAS 62191. 16 pages. Released April 1999.

IPC-9500-K

Here's a convenient and cost effective way to own the complete set of

process simulation documents for component attachment. This set of four documents, 95019504, contains the information you need to help you select components that will be compatible with your assembly process. Learn about manufacturing solder process limits, moisture sensitivity classifications, preconditioning and assembly process simulations. Save 50% by not purchasing documents individually. Each document is also available individually. 79 total pages. Released June 2003. Revision A coming soon — check the online store.

For more information on the documents in this set, go to page 12.

DESK REFERENCE MANUALS

IPC's Desk Reference Manuals are directly referenced to industry-consensus standards. Because each DRM is focused on a narrow range of technology covered by an IPC standard, its small size makes it easy to use. However, in some cases the text and illustrations were modified to help with interpretation of the criteria. DRMs are not intended to be used as standards.

IPC-DRM-18F

Component Identification Desk Reference Manual

The industry now has a convenient component identification resource at their workstations: the Component ID Desk Reference Manual. This comprehensive reference guide contains color 3D graphics and full descriptions of more than 40 of the most commonly used through hole and surface mount components, connectors and other hardware used in electronic assembly today. Also included is a terminology section with quick facts on polarity, orientation, packaging, lead styles, class ID letters and component reference designators (CRDs). The band reading section has full-color, easy-to-use code charts and other component value reading data. Includes the most widely used component schematic diagrams. 65 pages. Quantity discounts available.

HARD COPY:

IPC members: $30.00

Nonmembers: $60.00

IPC-DRM-SMT-C

Surface Mount Solder Joint Evaluation Desk Reference Manual

To help your workforce understand and apply the surface mount acceptance criteria from IPC standards, IPC has produced this Desk Reference Manual. DRM-SMT-C contains 3-D color illustrations for Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment and the minimum solder connections. All three classes of product are color-coded to make it convenient to use as a reference guide. This manual also contains high quality color photographs of the major solder defects and conditions, with the appropriate specification/paragraph reference to IPC-A-610C and J-STD-001C. Quantity discounts apply.

HARD COPY:

IPC members: $30.00

Nonmembers: $60.00

IPC-DRM-40E

Through Hole Solder Joint Evaluation Desk Reference Manual

The DRM-40E includes computer-generated 3-D graphics, as well as close-up photography, to help users understand the complex requirements in IPC standards. This Desk Reference Manual provides illustrations of component, barrel and solder-side coverage per requirements in the standards. The popularity of the DRM series is based on their detailed illustrations and clear language–all within one multipurpose reference manual. DRM-40E covers solder fillet, contact angle, wetting, vertical fill, land coverage and numerous defect conditions, for Class 1, 2 and 3 solder joints. Also includes a Terminology section. Quantity discounts available.

HARD COPY:

IPC members: $30.00

Nonmembers: $60.00

IPC-DRM-56

Wire Preparation & Crimping Desk Reference Manual

This handy Desk Reference Manual is a great tool to help explain the most important stamped and formed crimp criteria from the new industry standard on wire harness acceptability, IPC/WHMA-A-620. Using easy-to-understand graphics and language geared toward the factorylevel employees, DRM-56 will help ensure that your company’s products meet the required industry standards. Covers wire types, gauges, insulation stripping and contact types, IPC product categories and acceptance criteria, wire preparation, strand and insulation damage, conductor deformations, open and closed barrel crimp definitions and criteria, crimp deformations, cut-off tabs, punctures, insulation support crimps, inspection windows, bellmouth, conductor crimp requirements, conductor brush, closed barrel crimps, insulation damage and a glossary of related wire prep/crimping terminology. 32 pages. Quantity discounts apply.

HARD COPY:

IPC members: $30.00

Nonmembers: $60.00

www.ipc.org/onlinestore

IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information. 138 pages. Released March 1988.

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IPC-SM-785

Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

ANSI Approved. Guidelines for accelerated reliability testing of surface mount solder attachments. Used when evaluating and extrapolating the results of these tests toward actual use environments of electronic assemblies.

50 pages. Released November 1992.

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IPC-9701

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

ANSI Approved. Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments. 24 pages. Released January 2002.

HARD COPY: CD or DOWNLOAD: