Allen and Holberg - CMOS Analog Circuit Design
.pdfAllen and Holberg - CMOS Analog Circuit Design Page III.1-6
SIMPLIFIED SAH MODEL DERIVATION
Model-
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vGS |
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iD |
-vDS |
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v(y) |
dy |
Drain |
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y y+dy |
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Derivation- |
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Let the charge per unit area in the channel inversion layer be |
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Q (y) = C |
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(coulombs/cm2) |
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Define sheet conductivity of the inversion layer per square as |
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cm2 |
coulombs |
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1 |
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volt |
Ω/sq. |
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v·s |
cm2 |
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• Ohm's Law for current in a sheet is
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iD |
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dv |
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dy |
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Rewriting Ohm's Law gives, |
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iD |
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dv = σSW |
dy = µoQ (y)W |
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where dv is the voltage drop along the channel in the direction of y.
Rewriting as
iD dy = WµoQI(y)dv
and integrating along the channel for 0 to L gives
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vDS |
vDS |
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⌡iDdy = |
⌡WµoQI(y)dv = |
⌡WµoCox[vGS−v(y)−VT] dv |
0 |
0 |
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After integrating and evaluating the limits
Wµ C
i = o ox (v −V )v −
D L GS T DS
v2 DS
2
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-7 |
ILLUSTRATION OF THE SAH EQUATION
Plotting the Sah equation as iD vs. vDS results in -
iD
vDS = vGS - VT
Non-Sat Region |
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Saturation Region |
Increasing values of vGS
vDS
Define vDS(sat) = vGS − VT
Regions of Operation of the MOS Transistor
1.) Cutoff Region:
iD = 0, vGS − VT < 0 (Ignores subthreshold currents)
2.) Non-saturation Region
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µCoxW |
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, 0 < v |
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2L |
2(vGS − VT) − vDS v |
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3.) Saturation Region |
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µCoxW |
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2L |
(vGS − VT) |
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Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-8 |
SAH MODEL ADJUSTMENT TO INCLUDE EFFECTS OF VDS ON VT
From the previous derivation:
L |
vDS |
vDS |
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⌡ iD dy = |
⌡ WµoQI(y)dy = |
⌡ WµoCox[vGS − v(y) − VT]dv |
0 |
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Assume that the threshld voltage varies across the channel in the following way:
VT(y) = VT + v(y)
where VT is the value of the threshold voltage at the source end of the channel.
Integrating the above gives,
iD = |
WµoCox |
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v2(y) vDS |
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(vGS−VT)v(y) − (1+ |
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WµoCox |
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v2DS |
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iD = L |
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(vGS−VT)vDS − (1+ |
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To find vDS(sat), set the derivative of iD with respect to vDS equal to zero and solve for vDS = vDS(sat) to get,
vGS − VT vDS(sat) = 1 +
Therefore, in the saturation region, the drain current is
WµoCox |
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iD = 2(1+ )L vGS − VT |
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Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-9 |
EFFECTS OF BACK GATE (BULK-SOURCE)
Bulk-Source (vBS) influence on the transconductance characteristics-
iD |
Decreasing values |
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VBS = 0 |
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vDS ≥ vGS - VT |
vGS
VT0 VT1 |
VT2 V |
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T3 |
In general, the simple model incorporates the bulk effect into VT by the following empirically developed equation-
VT(VBS) =VT0 + γ 2|φf| + |vBS| − γ 2|φf|
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-10 |
EFFECTS OF THE BACK GATE - CONTINUED
Illustration-
VSB0 = 0V:
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VSB0=0V |
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Drain |
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VGS>VT |
VDS>0 |
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Bulk |
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Poly |
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p+ |
n+ |
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p- |
Substrate/Bulk |
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VSB1>0V:
VSB1
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Bulk Source
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p- Substrate/Bulk
VSB2 > VSB1:
VSB2
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Bulk Source
p+ |
n+ |
p- Substrate/Bulk
Gate Drain
VGS>VT VDS>0
Poly
n+
Gate Drain
VGS>VT VDS>0
Poly
n+
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-11 |
SAH MODEL INCLUDING CHANNEL LENGTH MODULATION
N-channel reference convention:
D iD +
G+ + B vDS
vGS vBS
- - -
S
Non-saturation-
iD = |
WµoCox |
vDS2 |
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(vGS − VT)vDS − |
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Saturation- |
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iD = |
WµoCox |
vDS(sat)2 |
(1 + λvDS) |
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(vGS − VT)vDS(sat) − |
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= WµoCox |
(vGS − VT) 2 (1 + λvDS) |
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where:
µo = zero field mobility (cm2/volt·sec)
Cox = gate oxide capacitance per unit area (F/cm2)
λ= channel-length modulation parameter (volts-1) VT = VT0 + γ 2|φf| + |vBS| − 2|φf|
VT0 = zero bias threshold voltage
γ = bulk threshold parameter (volts1/2)
2|φf| = strong inversion surface potential (volts)
When solving for p-channel devices, negate all voltages and use the n- channel model with p-channel parameters and negate the current. Also negate VT0 of the p device.
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-12 |
OUTPUT CHARACTERISTICS OF THE MOS TRANSISTOR
iD /ID0
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vDS = vGS - VT |
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vGS -VT |
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1.0 |
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VGS0 - VT |
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Non-Sat |
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Saturation Region |
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Region |
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vGS-VT |
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0.75 |
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= 0.867 |
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VGS0 - VT |
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Channel modulation effects |
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vGS-VT |
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= 0.707 |
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0.5 |
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GS0 |
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vGS-VT |
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0.25 |
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GS0 |
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vGS-VT |
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Cutoff Region |
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VGS0 - VT |
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vDS |
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2.0 |
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VGS0 - VT |
Notation:
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ß = K' L = ( oCox) |
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Note:
oCox = K'
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-13 |
GRAPHICAL INTERPRETATION OF λ
Assume the MOS is transistor is saturated-
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µCoxW |
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D |
2L |
(vGS − VT) 2(1 + λvDS) |
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Define iD(0) = iD when vDS = 0V. |
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(vGS − VT)2 |
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Now,
iD = iD(0) [1+λvDS] = iD(0) + λiD(0) vDS
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vDS = λiD (0) iD |
− λ |
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Matching with y = mx + b gives |
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vDS |
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λiD(0) |
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iD(0) |
iD |
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iD |
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iD3(0) |
VGS3 |
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iD2(0) |
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vDS
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λ
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-14 |
SPICE LEVEL 1 MODEL PARAMETERS FOR A TYPICAL
BULK CMOS PROCESS (0.8 m)
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Model |
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Typical Parameter |
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Value |
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Parameter |
Description |
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NMOS |
PMOS |
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VT0 |
ThresholdVoltage forVBS = 0V |
0.75±0.15 |
−0.85±0.15 |
Volts |
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K' |
Transconductance Parameter |
110±10% |
50±10% |
µA/V2 |
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(sat.) |
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γ |
Bulk Threshold Parameter |
0.4 |
0.57 |
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λ |
Channel Length Modulation |
0.04 (L=1 m) |
0.05 (L = 1 m) |
V-1 |
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0.01 (L=2 m) |
0.01 (L = 2 m) |
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φ = 2φF |
Surface potential at strong |
0.7 |
0.8 |
Volts |
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inversion |
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These values are based on a 0.8 m silicon-gate bulk CMOS n-well process.
Allen and Holberg - CMOS Analog Circuit Design |
Page III.1-15 |
WEAK INVERSION MODEL (Simple)
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iD (nA) |
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Weak |
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iD |
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1000.0 |
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inversion |
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Strong |
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100.0 |
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inversion |
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10.0 |
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1.0 |
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VT VON |
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VT VON |
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This model is appropriate for hand calculations but it does not accommodate a smooth transition into the strong-inversion region.
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qvGS |
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The transition point where this relationship is valid occurs at approximately
kT vgs < VT + n q
Weak-Moderate-Strong Inversion Approximation
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Moderate |
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inversion region |
iD (nA) |
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1000.0 |
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100.0 |
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inversion |
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10.0 |
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1.0 |
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vGS |