- •INTRODUCTION TO ASICs
- •1.1 Types of ASICs
- •1.2 Design Flow
- •1.3 Case Study
- •1.4 Economics of ASICs
- •1.5 ASIC Cell Libraries
- •1.6 Summary
- •1.7 Problems
- •1.8 Bibliography
- •1.9 References
- •CMOS LOGIC
- •2.12 References
- •2.1 CMOS Transistors
- •2.2 The CMOS Process
- •2.3 CMOS Design Rules
- •2.4 Combinational Logic Cells
- •2.5 Sequential Logic Cells
- •2.6 Datapath Logic Cells
- •2.7 I/O Cells
- •2.8 Cell Compilers
- •2.9 Summary
- •2.10 Problems
- •2.11 Bibliography
- •ASIC LIBRARY DESIGN
- •3.1 Transistors as Resistors
- •3.3 Logical Effort
- •3.4 Library-Cell Design
- •3.5 Library Architecture
- •3.6 Gate-Array Design
- •3.7 Standard-Cell Design
- •3.8 Datapath-Cell Design
- •3.9 Summary
- •3.10 Problems
- •3.11 Bibliography
- •3.12 References
- •PROGRAMMABLE ASICs
- •4.1 The Antifuse
- •4.2 Static RAM
- •4.4 Practical Issues
- •4.5 Specifications
- •4.6 PREP Benchmarks
- •4.7 FPGA Economics
- •4.8 Summary
- •4.9 Problems
- •4.10 Bibliography
- •4.11 References
- •5.1 Actel ACT
- •5.2 Xilinx LCA
- •5.3 Altera FLEX
- •5.4 Altera MAX
- •5.5 Summary
- •5.6 Problems
- •5.7 Bibliography
- •5.8 References
- •6.1 DC Output
- •6.2 AC Output
- •6.3 DC Input
- •6.4 AC Input
- •6.5 Clock Input
- •6.6 Power Input
- •6.7 Xilinx I/O Block
- •6.8 Other I/O Cells
- •6.9 Summary
- •6.10 Problems
- •6.11 Bibliography
- •6.12 References
- •7.1 Actel ACT
- •7.2 Xilinx LCA
- •7.3 Xilinx EPLD
- •7.4 Altera MAX 5000 and 7000
- •7.5 Altera MAX 9000
- •7.6 Altera FLEX
- •7.7 Summary
- •7.8 Problems
- •7.9 Bibliography
- •7.10 References
- •8.1 Design Systems
- •8.2 Logic Synthesis
- •8.3 The Halfgate ASIC
- •8.3.4 Comparison
- •8.4 Summary
- •8.5 Problems
- •8.6 Bibliography
- •8.7 References
- •9.1 Schematic Entry
- •9.3 PLA Tools
- •9.4 EDIF
- •9.5 CFI Design Representation
- •9.6 Summary
- •9.7 Problems
- •9.8 Bibliography
- •9.9 References
- •VHDL
- •10.1 A Counter
- •10.2 A 4-bit Multiplier
- •10.3 Syntax and Semantics of VHDL
- •10.5 Entities and Architectures
- •10.6 Packages and Libraries
- •10.7 Interface Declarations
- •10.8 Type Declarations
- •10.9 Other Declarations
- •10.10 Sequential Statements
- •10.11 Operators
- •10.12 Arithmetic
- •10.13 Concurrent Statements
- •10.14 Execution
- •10.15 Configurations and Specifications
- •10.16 An Engine Controller
- •10.17 Summary
- •10.18 Problems
- •10.19 Bibliography
- •10.20 References
- •IEEE Language Reference Manual project
- •VERILOG HDL
- •11.1 A Counter
- •11.2 Basics of the Verilog Language
- •11.3 Operators
- •11.4 Hierarchy
- •11.5 Procedures and Assignments
- •11.6 Timing Controls and Delay
- •11.7 Tasks and Functions
- •11.8 Control Statements
- •11.9 Logic-Gate Modeling
- •11.10 Modeling Delay
- •11.11 Altering Parameters
- •11.12 A Viterbi Decoder
- •11.13 Other Verilog Features
- •11.14 Summary
- •11.15 Problems
- •11.16 Bibliography
- •11.17 References
- •12.2 A Comparator/MUX
- •12.3 Inside a Logic Synthesizer
- •12.6 VHDL and Logic Synthesis
- •12.8 Memory Synthesis
- •12.9 The Multiplier
- •12.10 The Engine Controller
- •12.13 Summary
- •12.14 Problems
- •12.15 Bibliography
- •12.16 References
- •SIMULATION
- •13.1 Types of Simulation
- •13.3 Logic Systems
- •13.4 How Logic Simulation
- •13.5 Cell Models
- •13.6 Delay Models
- •13.7 Static Timing Analysis
- •13.8 Formal Verification
- •13.9 Switch-Level Simulation
- •13.11 Summary
- •13.12 Problems
- •13.13 Bibliography
- •13.14 References
- •TEST
- •14.1 The Importance of Test
- •14.2 Boundary-Scan Test
- •14.3 Faults
- •14.4 Fault Simulation
- •14.6 Scan Test
- •14.7 Built-in Self-test
- •14.8 A Simple Test Example
- •14.10 Summary
- •14.11 Problems
- •14.12 Bibliography
- •14.13 References
- •15.1 Physical Design
- •15.3 System Partitioning
- •15.4 Estimating ASIC Size
- •15.5 Power Dissipation
- •15.6 FPGA Partitioning
- •15.7 Partitioning Methods
- •15.8 Summary
- •15.9 Problems
- •15.10 Bibliography
- •15.11 References
- •16.1 Floorplanning
- •16.2 Placement
- •16.3 Physical Design Flow
- •16.4 Information Formats
- •16.5 Summary
- •16.6 Problems
- •16.7 Bibliography
- •16.8 References
- •ROUTING
- •17.1 Global Routing
- •17.2 Detailed Routing
- •17.3 Special Routing
- •17.5 Summary
- •17.6 Problems
- •17.7 Bibliography
- •17.8 References
- •A.2 VHDL Syntax
- •A.3 BNF Index
- •A.5 References
- •B.2 Verilog HDL Syntax
- •B.3 BNF Index
- •B.4 Verilog HDL LRM
- •B.5 Bibliography
- •B.6 References
Last Edited by SP 14112004
ROUTING
Once the designer has floorplanned a chip and the logic cells within the flexible blocks have been placed, it is time to make the connections by routing the chip. This is still a hard problem that is made easier by dividing it into smaller problems. Routing is usually split into global routing followed by detailed routing
.
Suppose the ASIC is North America and some travelers in California need advice on how to drive from Stanford (near San Francisco) to Caltech (near Los Angeles). The floorplanner has decided that California is on the left (west) side of the ASIC and the placement tool has put Stanford in Northern California and Caltech in Southern California. Floorplanning and placement have defined the roads and freeways. There are two ways to go: the coastal route (using Highway 101) or the inland route (using Interstate I5, which is usually faster). The global router specifies the coastal route because the travelers are not in a hurry and I5 is congested (the global router knows this because it has already routed onto I5 many other travelers that are in a hurry today). Next, the detailed router looks at a map and gives indications from Stanford onto Highway 101 south through San Jose, Monterey, and Santa Barbara to Los Angeles and then off the freeway to Caltech in Pasadena.
Figure 17.1 shows the core of the Viterbi decoder after the placement step. This implementation consists entirely of standard cells (18 rows). The I/O pads are not included in this example we can route the I/O pads after we route the core (though this is not always a good idea). Figure 17.2 shows the Viterbi decoder chip after global and detailed routing. The routing runs in the channels between the rows of logic cells, but the individual interconnections are too small to see.
FIGURE 17.1 The core of the Viterbi decoder chip after placement (a screen shot from Cadence Cell Ensemble). This is the same placement as shown in Figure 16.2, but without the channel labels. You can see the rows of standard cells; the widest cells are the D flip-flops.
FIGURE 17.2 The core of the Viterbi decoder chip after the completion of global and detailed routing (a screen shot from Cadence Cell Ensemble). This chip uses two-level metal. Although you cannot see the difference, m1 runs in the horizontal direction and m2 in the vertical direction.