- •Features
- •1. Pin Configurations
- •2. Overview
- •2.1 Block Diagram
- •2.2 Pin Descriptions
- •2.2.3 Port B (PB7:PB0) – XTAL1/XTAL2/TOSC1/TOSC2
- •2.2.4 Port C (PC5:PC0)
- •2.2.5 PC6/RESET
- •2.2.6 Port D (PD7:PD0)
- •2.2.7 RESET
- •2.2.9 AREF
- •2.2.10 ADC7:6 (TQFP and QFN/MLF Package Only)
- •3. Resources
- •4. Data Retention
- •5. About Code Examples
- •6. AVR CPU Core
- •6.1 Overview
- •6.2 Arithmetic Logic Unit – ALU
- •6.3 Status Register
- •6.3.1 SREG – The AVR Status Register
- •6.4 General Purpose Register File
- •6.5 Stack Pointer
- •6.5.1 SPH and SPL – Stack Pointer High and Low Register
- •6.6 Instruction Execution Timing
- •6.7 Reset and Interrupt Handling
- •6.7.1 Interrupt Response Time
- •7. AVR Memories
- •7.1 Overview
- •7.3 SRAM Data Memory
- •7.3.1 Data Memory Access Times
- •7.4 EEPROM Data Memory
- •7.4.1 EEPROM Read/Write Access
- •7.5 I/O Memory
- •7.6 Register Description
- •7.6.1 EEARH and EEARL – The EEPROM Address Register
- •7.6.2 EEDR – The EEPROM Data Register
- •7.6.3 EECR – The EEPROM Control Register
- •7.6.5 Preventing EEPROM Corruption
- •8. System Clock and Clock Options
- •8.1 Clock Systems and their Distribution
- •8.2 Clock Sources
- •8.3 Crystal Oscillator
- •8.5 External RC Oscillator
- •8.6 Calibrated Internal RC Oscillator
- •8.7 External Clock
- •8.8 Timer/Counter Oscillator
- •8.9 Register Description
- •8.9.1 OSCCAL – Oscillator Calibration Register
- •9. Power Management and Sleep Modes
- •9.1 Sleep Modes
- •9.2 Idle Mode
- •9.3 ADC Noise Reduction Mode
- •9.6 Standby Mode
- •9.7 Minimizing Power Consumption
- •9.7.2 Analog Comparator
- •9.7.4 Internal Voltage Reference
- •9.7.5 Watchdog Timer
- •9.7.6 Port Pins
- •9.8 Register Description
- •9.8.1 MCUCR – MCU Control Register
- •10. System Control and Reset
- •10.1 Resetting the AVR
- •10.2 Reset Sources
- •10.2.2 External Reset
- •10.2.4 Watchdog Reset
- •10.3 Internal Voltage Reference
- •10.4 Watchdog Timer
- •10.5 Timed Sequences for Changing the Configuration of the Watchdog Timer
- •10.5.1 Safety Level 1 (WDTON Fuse Unprogrammed)
- •10.5.2 Safety Level 2 (WDTON Fuse Programmed)
- •10.6 Register Description
- •10.6.1 MCUCSR – MCU Control and Status Register
- •10.6.2 WDTCR – Watchdog Timer Control Register
- •11. Interrupts
- •11.1 Interrupt Vectors in ATmega8A
- •11.1.1 Moving Interrupts Between Application and Boot Space
- •11.2 Register Description
- •11.2.1 GICR – General Interrupt Control Register
- •12. I/O Ports
- •12.1 Overview
- •12.2 Ports as General Digital I/O
- •12.2.1 Configuring the Pin
- •12.2.2 Reading the Pin Value
- •12.2.3 Digital Input Enable and Sleep Modes
- •12.2.4 Unconnected pins
- •12.3 Alternate Port Functions
- •12.3.1 SFIOR – Special Function IO Register
- •12.3.2 Alternate Functions of Port B
- •12.3.3 Alternate Functions of Port C
- •12.3.4 Alternate Functions of Port D
- •12.4 Register Description
- •12.4.1 PORTB – The Port B Data Register
- •12.4.2 DDRB – The Port B Data Direction Register
- •12.4.3 PINB – The Port B Input Pins Address
- •12.4.4 PORTC – The Port C Data Register
- •12.4.5 DDRC – The Port C Data Direction Register
- •12.4.6 PINC – The Port C Input Pins Address
- •12.4.7 PORTD – The Port D Data Register
- •12.4.8 DDRD – The Port D Data Direction Register
- •12.4.9 PIND – The Port D Input Pins Address
- •13. External Interrupts
- •13.1 Register Description
- •13.1.1 MCUCR – MCU Control Register
- •13.1.2 GICR – General Interrupt Control Register
- •13.1.3 GIFR – General Interrupt Flag Register
- •14. 8-bit Timer/Counter0
- •14.1 Features
- •14.2 Overview
- •14.2.1 Registers
- •14.2.2 Definitions
- •14.3 Timer/Counter Clock Sources
- •14.4 Counter Unit
- •14.5 Operation
- •14.6 Timer/Counter Timing Diagrams
- •14.7 Register Description
- •14.7.1 TCCR0 – Timer/Counter Control Register
- •14.7.2 TCNT0 – Timer/Counter Register
- •14.7.3 TIMSK – Timer/Counter Interrupt Mask Register
- •14.7.4 TIFR – Timer/Counter Interrupt Flag Register
- •15. Timer/Counter0 and Timer/Counter1 Prescalers
- •15.1 Overview
- •15.2 Internal Clock Source
- •15.3 Prescaler Reset
- •15.4 External Clock Source
- •15.5 Register Description
- •15.5.1 SFIOR – Special Function IO Register
- •16. 16-bit Timer/Counter1
- •16.1 Features
- •16.2 Overview
- •16.2.1 Registers
- •16.2.2 Definitions
- •16.2.3 Compatibility
- •16.3.1 Reusing the Temporary High Byte Register
- •16.4 Timer/Counter Clock Sources
- •16.5 Counter Unit
- •16.6 Input Capture Unit
- •16.6.1 Input Capture Pin Source
- •16.6.2 Noise Canceler
- •16.6.3 Using the Input Capture Unit
- •16.7 Output Compare Units
- •16.7.1 Force Output Compare
- •16.7.2 Compare Match Blocking by TCNT1 Write
- •16.7.3 Using the Output Compare Unit
- •16.8 Compare Match Output Unit
- •16.8.1 Compare Output Mode and Waveform Generation
- •16.9 Modes of Operation
- •16.9.1 Normal Mode
- •16.9.2 Clear Timer on Compare Match (CTC) Mode
- •16.9.3 Fast PWM Mode
- •16.9.4 Phase Correct PWM Mode
- •16.9.5 Phase and Frequency Correct PWM Mode
- •16.10 Timer/Counter Timing Diagrams
- •16.11 Register Description
- •16.11.1 TCCR1A – Timer/Counter 1 Control Register A
- •16.11.2 TCCR1B – Timer/Counter 1 Control Register B
- •16.11.3 TCNT1H and TCNT1L – Timer/Counter 1
- •16.11.4 OCR1AH and OCR1AL– Output Compare Register 1 A
- •16.11.5 OCR1BH and OCR1BL – Output Compare Register 1 B
- •16.11.6 ICR1H and ICR1L – Input Capture Register 1
- •17. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- •17.1 Features
- •17.2 Overview
- •17.2.1 Registers
- •17.2.2 Definitions
- •17.3 Timer/Counter Clock Sources
- •17.4 Counter Unit
- •17.5 Output Compare Unit
- •17.5.1 Force Output Compare
- •17.5.2 Compare Match Blocking by TCNT2 Write
- •17.5.3 Using the Output Compare Unit
- •17.6 Compare Match Output Unit
- •17.6.1 Compare Output Mode and Waveform Generation
- •17.7 Modes of Operation
- •17.7.1 Normal Mode
- •17.7.2 Clear Timer on Compare Match (CTC) Mode
- •17.7.3 Fast PWM Mode
- •17.7.4 Phase Correct PWM Mode
- •17.8 Timer/Counter Timing Diagrams
- •17.9 Asynchronous Operation of the Timer/Counter
- •17.9.1 Asynchronous Operation of Timer/Counter2
- •17.10 Timer/Counter Prescaler
- •17.11 Register Description
- •17.11.1 TCCR2 – Timer/Counter Control Register
- •17.11.2 TCNT2 – Timer/Counter Register
- •17.11.3 OCR2 – Output Compare Register
- •17.11.4 ASSR – Asynchronous Status Register
- •17.11.5 TIMSK – Timer/Counter Interrupt Mask Register
- •17.11.6 TIFR – Timer/Counter Interrupt Flag Register
- •17.11.7 SFIOR – Special Function IO Register
- •18. Serial Peripheral Interface – SPI
- •18.1 Features
- •18.2 Overview
- •18.3 SS Pin Functionality
- •18.3.1 Slave Mode
- •18.3.2 Master Mode
- •18.4 Data Modes
- •18.5 Register Description
- •18.5.1 SPCR – SPI Control Register
- •18.5.2 SPSR – SPI Status Register
- •18.5.3 SPDR – SPI Data Register
- •19. USART
- •19.1 Features
- •19.2 Overview
- •19.2.1 AVR USART vs. AVR UART – Compatibility
- •19.3 Clock Generation
- •19.3.1 Internal Clock Generation – The Baud Rate Generator
- •19.3.2 Double Speed Operation (U2X)
- •19.3.3 External Clock
- •19.3.4 Synchronous Clock Operation
- •19.4 Frame Formats
- •19.4.1 Parity Bit Calculation
- •19.5 USART Initialization
- •19.6 Data Transmission – The USART Transmitter
- •19.6.1 Sending Frames with 5 to 8 Data Bits
- •19.6.2 Sending Frames with 9 Data Bits
- •19.6.3 Transmitter Flags and Interrupts
- •19.6.4 Parity Generator
- •19.6.5 Disabling the Transmitter
- •19.6.6 Data Reception – The USART Receiver
- •Receiving Frames with 5 to 8 Data Bits
- •19.6.7 Receiving Frames with 9 Data Bits
- •19.6.8 Receive Compete Flag and Interrupt
- •19.6.9 Receiver Error Flags
- •19.6.10 Parity Checker
- •19.6.11 Disabling the Receiver
- •19.7 Asynchronous Data Reception
- •19.7.1 Asynchronous Clock Recovery
- •19.7.2 Asynchronous Data Recovery
- •19.7.3 Asynchronous Operational Range
- •19.8.1 Using MPCM
- •19.9 Accessing UBRRH/UCSRC Registers
- •19.9.1 Write Access
- •19.9.2 Read Access
- •19.10 Register Description
- •19.10.1 UDR– USART I/O Data Register
- •19.10.2 UCSRA – USART Control and Status Register A
- •19.10.3 UCSRB – USART Control and Status Register B
- •19.10.4 UCSRC – USART Control and Status Register C
- •19.10.5 UBRRL and UBRRH – USART Baud Rate Registers
- •19.11 Examples of Baud Rate Setting
- •20. Two-wire Serial Interface
- •20.1 Features
- •20.2 Overview
- •20.2.1 SCL and SDA Pins
- •20.2.2 Bit Rate Generator Unit
- •20.2.3 Bus Interface Unit
- •20.2.4 Address Match Unit
- •20.2.5 Control Unit
- •20.3.1 TWI Terminology
- •20.3.2 Electrical Interconnection
- •20.4 Data Transfer and Frame Format
- •20.4.1 Transferring Bits
- •20.4.2 START and STOP Conditions
- •20.4.3 Address Packet Format
- •20.4.4 Data Packet Format
- •20.4.5 Combining Address and Data Packets into a Transmission
- •20.6 Using the TWI
- •20.6.1 Transmission Modes
- •20.6.2 Master Transmitter Mode
- •20.6.3 Master Receiver Mode
- •20.6.4 Slave Receiver Mode
- •20.6.5 Slave Transmitter Mode
- •20.6.6 Miscellaneous States
- •20.6.7 Combining Several TWI Modes
- •20.8 Register Description
- •20.8.1 TWBR – TWI Bit Rate Register
- •20.8.2 TWCR – TWI Control Register
- •20.8.3 TWI Status Register – TWSR
- •20.8.4 TWDR – TWI Data Register
- •20.8.5 TWAR – TWI (Slave) Address Register
- •21. Analog Comparator
- •21.1 Overview
- •21.2 Analog Comparator Multiplexed Input
- •21.3 Register Description
- •21.3.1 SFIOR – Special Function IO Register
- •21.3.2 ACSR – Analog Comparator Control and Status Register
- •22. Analog-to-Digital Converter
- •22.1 Features
- •22.2 Overview
- •22.3 Starting a Conversion
- •22.4 Prescaling and Conversion Timing
- •22.5 Changing Channel or Reference Selection
- •22.5.1 ADC Input Channels
- •22.5.2 ADC Voltage Reference
- •22.6 ADC Noise Canceler
- •22.6.1 Analog Input Circuitry
- •22.6.2 Analog Noise Canceling Techniques
- •22.6.3 ADC Accuracy Definitions
- •22.7 ADC Conversion Result
- •22.8 Register Description
- •22.8.1 ADMUX – ADC Multiplexer Selection Register – ADMUX
- •22.8.2 ADCSRA – ADC Control and Status Register A
- •22.8.3 ADCL and ADCH – The ADC Data Register
- •23. Boot Loader Support – Read-While-Write Self-Programming
- •23.1 Features
- •23.2 Overview
- •23.3 Application and Boot Loader Flash Sections
- •23.3.1 Application Section
- •23.3.2 BLS – Boot Loader Section
- •23.5 Boot Loader Lock Bits
- •23.6 Entering the Boot Loader Program
- •23.8.1 Performing Page Erase by SPM
- •23.8.2 Filling the Temporary Buffer (Page Loading)
- •23.8.3 Performing a Page Write
- •23.8.4 Using the SPM Interrupt
- •23.8.5 Consideration While Updating BLS
- •23.8.7 Setting the Boot Loader Lock Bits by SPM
- •23.8.8 EEPROM Write Prevents Writing to SPMCR
- •23.8.9 Reading the Fuse and Lock Bits from Software
- •23.8.10 Preventing Flash Corruption
- •23.8.11 Programming Time for Flash when using SPM
- •23.8.12 Simple Assembly Code Example for a Boot Loader
- •23.8.13 Boot Loader Parameters
- •23.9 Register Description
- •23.9.1 Store Program Memory Control Register – SPMCR
- •24. Memory Programming
- •24.1 Program And Data Memory Lock Bits
- •24.2 Fuse Bits
- •24.2.1 Latching of Fuses
- •24.3 Signature Bytes
- •24.4 Calibration Byte
- •24.5 Page Size
- •24.6 Parallel Programming Parameters, Pin Mapping, and Commands
- •24.6.1 Signal Names
- •24.7 Parallel Programming
- •24.7.1 Enter Programming Mode
- •24.7.2 Considerations for Efficient Programming
- •24.7.3 Chip Erase
- •24.7.4 Programming the Flash
- •24.7.5 Programming the EEPROM
- •24.7.6 Reading the Flash
- •24.7.7 Reading the EEPROM
- •24.7.8 Programming the Fuse Low Bits
- •24.7.9 Programming the Fuse High Bits
- •24.7.10 Programming the Lock Bits
- •24.7.11 Reading the Fuse and Lock Bits
- •24.7.12 Reading the Signature Bytes
- •24.7.13 Reading the Calibration Byte
- •24.7.14 Parallel Programming Characteristics
- •24.8 Serial Downloading
- •24.9 Serial Programming Pin Mapping
- •24.9.1 Serial Programming Algorithm
- •24.9.2 Data Polling Flash
- •24.9.3 Data Polling EEPROM
- •24.9.4 SPI Serial Programming Characteristics
- •25. Electrical Characteristics
- •25.1 Absolute Maximum Ratings*
- •25.2 DC Characteristics
- •25.3 Speed Grades
- •25.4 Clock Characteristics
- •25.4.1 External Clock Drive Waveforms
- •25.4.2 External Clock Drive
- •25.5 System and Reset Characteristics
- •25.7 SPI Timing Characteristics
- •25.8 ADC Characteristics
- •26. Typical Characteristics
- •26.1 Active Supply Current
- •26.2 Idle Supply Current
- •26.5 Standby Supply Current
- •26.7 Pin Driver Strength
- •26.8 Pin Thresholds and Hysteresis
- •26.9 Bod Thresholds and Analog Comparator Offset
- •26.10 Internal Oscillator Speed
- •26.11 Current Consumption of Peripheral Units
- •26.12 Current Consumption in Reset and Reset Pulsewidth
- •27. Register Summary
- •28. Instruction Set Summary
- •29. Ordering Information
- •30. Packaging Information
- •31. Errata
- •31.1 ATmega8A, rev. L
- •32. Datasheet Revision History
- •Table of Contents
ATmega8A
25. Electrical Characteristics
Note: Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized.
25.1Absolute Maximum Ratings*
..................................Operating Temperature |
-55°C to +125°C |
*NOTICE: Stresses beyond those listed under “Absolute |
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Maximum Ratings” may cause permanent dam- |
Storage Temperature ..................................... |
-65°C to +150°C |
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functional operation of the device at these or |
Voltage on any Pin except |
RESET |
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other conditions beyond those indicated in the |
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with respect to Ground ................................ |
- 0.5V to VCC+0.5V |
operational sections of this specification is not |
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Voltage on |
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with respect to Ground |
-0.5V to +13.0V |
implied. Exposure to absolute maximum rating |
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RESET |
conditions for extended periods may affect |
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Maximum Operating Voltage |
6.0V |
device reliability. |
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DC Current per I/O Pin ............................................... |
40.0 mA |
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DC Current VCC and GND Pins................................ |
300.0 mA |
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25.2DC Characteristics
TA = -40°C to 85°C, VCC = 2.7V to 5.5V (unless otherwise noted)
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Parameter |
Condition |
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Max |
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Input Low Voltage except |
VCC = 2.7V - 5.5V |
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VIL |
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XTAL1 and |
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-0.5 |
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0.2 VCC |
V |
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VIH |
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Input High Voltage except |
VCC = 2.7V - 5.5V |
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0.6 VCC |
(2) |
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VCC + 0.5 |
V |
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XTAL1 and |
RESET |
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VIL1 |
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Input Low Voltage |
VCC = 2.7V - 5.5V |
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-0.5 |
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V |
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XTAL1 pin |
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0.1 VCC |
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VIH1 |
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Input High Voltage |
VCC = 2.7V - 5.5V |
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0.8 VCC |
(2) |
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VCC + 0.5 |
V |
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XTAL 1 pin |
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VIL2 |
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Input Low Voltage |
VCC = 2.7V - 5.5V |
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-0.5 |
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0.2 VCC |
V |
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VIH2 |
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Input High Voltage |
VCC = 2.7V - 5.5V |
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0.9 VCC |
(2) |
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VCC + 0.5 |
V |
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VIL3 |
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Input Low Voltage |
VCC = 2.7V - 5.5V |
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-0.5 |
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0.2 VCC |
V |
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Input High Voltage |
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0.6 VCC |
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VIH3 |
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VCC = 2.7V - 5.5V |
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VCC + 0.5 |
V |
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0.7 VCC |
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Output Low Voltage(3) |
I |
OL |
= 20 mA, V |
= 5V |
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V |
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CC |
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(Ports B,C,D) |
IOL = 10 mA, VCC = 3V |
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Output High Voltage(4) |
I |
OH |
= -20 mA, V |
= 5V |
4.2 |
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(Ports B,C,D) |
IOH = -10 mA, VCC = 3V |
2.2 |
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IIL |
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Input Leakage |
Vcc = 5.5V, pin low |
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µA |
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Current I/O Pin |
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244
8159C–AVR–07/09
ATmega8A
TA = -40°C to 85°C, VCC = 2.7V to 5.5V (unless otherwise noted) |
(Continued) |
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Parameter |
Condition |
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Min |
Typ |
Max |
Units |
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IIH |
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Input Leakage |
Vcc = 5.5V, pin high |
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1 |
µA |
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Current I/O Pin |
(absolute value) |
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RRST |
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Reset Pull-up Resistor |
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30 |
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80 |
kΩ |
Rpu |
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I/O Pin Pull-up Resistor |
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20 |
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50 |
kΩ |
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Active 4 MHz, VCC = 3V |
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2 |
5 |
mA |
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Power Supply Current |
Active 8 MHz, VCC = 5V |
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6 |
15 |
mA |
ICC |
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Idle 4 MHz, VCC = 3V |
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0.5 |
2 |
mA |
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Idle 8 MHz, VCC = 5V |
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2.2 |
7 |
mA |
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Power-down mode(5) |
WDT enabled, VCC = 3V |
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<10 |
28 |
µA |
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WDT disabled, VCC = 3V |
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<1 |
3 |
µA |
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VACIO |
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Analog Comparator |
VCC = 5V |
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40 |
mV |
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Input Offset Voltage |
Vin = VCC/2 |
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IACLK |
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Analog Comparator |
VCC = 5V |
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-50 |
|
50 |
nA |
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Input Leakage Current |
Vin = VCC/2 |
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tACPD |
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Analog Comparator |
VCC = 2.7V |
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|
750 |
|
ns |
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Propagation Delay |
VCC = 5.0V |
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|
500 |
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Notes: 1. |
“Max” means the highest value where the pin is guaranteed to be read as low |
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2.“Min” means the lowest value where the pin is guaranteed to be read as high
3.Although each I/O port can sink more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed:
PDIP, TQFP, and QFN/MLF Package:
1] The sum of all IOL, for all ports, should not exceed 300 mA.
2] The sum of all IOL, for ports C0 - C5 should not exceed 100 mA.
3] The sum of all IOL, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200 mA.
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition.
4.Although each I/O port can source more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed:
PDIP, TQFP, and QFN/MLF Package:
1] The sum of all IOH, for all ports, should not exceed 300 mA.
2] The sum of all IOH, for port C0 - C5, should not exceed 100 mA.
3] The sum of all IOH, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200 mA.
If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition.
5.Minimum VCC for Power-down is 2.5V.
245
8159C–AVR–07/09