- •1. Read the text and answer the questions.
- •2. Match the words with the correct definition.
- •3. Complete the sentences below with one of the words from the box.
- •1. Before you read this text discuss the following questions.
- •3. Decide whether the statements are true or false.
- •1. Before you read the text match these words (1-6) to their meaning (a-f)
- •2. Answer the following questions.
- •3. Complete the sentences using the words in box.
- •1. Answer the questions before reading the text.
- •2. Match the beginning of the sentences (1-5) with their endings (a-e)
- •3. Explain the meaning of the following words.
- •1. Answer the question before reading the text.
- •2. State the country where the following manufacturers in computing are
- •5. Match the words with their definition.
- •1. Name five major producers of microprocessors.
- •Intel Core i7-975 ee and Core i5-750
- •2. Read the text an answer the questions after it.
- •3. Read the text again and choose the correct answer to complete these
- •1. Answer these questions.
- •In a hermetically sealed hc-49/us package,
- •3. Find the word in the text that best matches with the appropriate
- •4. Decide whether the following statements true or false.
- •1. Guess the meaning of the following words
- •2. Read the text and answer the questions after it.
- •3. Complete the sentences below using the words from the box.
- •4. Make up questions for the following answers.
- •1. Read the text and answer the questions.
- •2. Complete the sentences below with one of the words from the box.
- •3. Find synonyms for the following words in the text.
- •2. Read the following text and check your answers.
- •3. Read the text and say whether the sentence is true or false.
- •5. Word Search. Find as many words from the text as possible in the grid below. There are 5 words all together.
- •1. Read the text and translate it into Ukrainian.
- •2. Read the text, complete the sentences and translate them into Ukrainian.
- •4. Put the letters into the order to make up words. Find sentences with these words in the text and translate them into Ukrainian.
- •5. Put all kinds of questions to the given sentences.
- •1. Read and discuss the text.
- •3. Fill in the missing words and translate the sentences into Ukrainian.
- •1. Before reading the text, choose the possible answer.
- •2. Read the following text and discuss in groups.
- •4. Answer the following questions.
- •1. Read the text and say what debugging is.
- •2. Read the text and choose the right variant.
- •3. Answer the following questions.
- •5 . Put all kinds of questions to the given sentences.
- •1. Before reading the text, try to answer the following questions:
- •3. Say whether it is true or false.
- •4. Find 5 words from the text in the grid below. Then make up your own sentences using these words.
- •5. Put the words into the right order to make up sentences and translate the sentences into Ukrainian.
- •1. Read the text and translate it into Ukrainian.
- •5. Write a short summary of the text.
- •1. Before reading the text try to answer the following questions and
- •2. Read the text, give it your own title and make up a plan to it.
- •3. Say whether it is true or false.
- •4. Read the given sentences and denote the tense and voice. Put all
- •5. Write a summary to the text using the given key-words.
- •1. Read the text and translate it into Ukrainian.
- •2. Read the text and answer the questions.
- •3. Put the letters into the correct order to make up the words. Find these words in the text and translate sentences with the given words into Ukrainian.
- •5. Give your own title to the text and make up a plan to it. Retell the text according to your plan.
- •1. Before reading the text try to answer the following questions.
- •3. Say whether these sentences are true or false.
- •Summary Lesson
- •II . Make up your own sentences using the words given in the guessing game above.
- •Vocabulary file
- •Vocabulary file 48
- •Методичні вказівки
3. Complete the sentences below using the words from the box.
Equipment invention silicon fabrication transistors discrete semiconductor germanium
The site includes an excellent set of links to________ manufacturers.
A patent is a monopoly right which protects an______ for up to 20 years.
The construction of components, on the micron scale, is by______ micromachining, electro deposition and thin film metal and dielectric deposition
_________of devices will be done in collaboration with industry.
According to Moore's law, the number of ______on a chip doubles every two years.
The circuit design uses ______ transistors, not an RF module.
CMOS, which stands for complementary metal oxide______, is the technology base for silicon transistors.
It's quite easy to set the tester up to show thermal runaway in ________transistors.
4. Make up questions for the following answers.
Dummer unsuccessfully attempted to build an integrated circuit in 1956.
Kilby successfully demonstrated the first working integrated circuit in 1958.
Kilby won the 2000 Nobel Prize in Physics.
It was made of germanium.
By experimental discoveries.
Cost and performance.
Because the components are small and close together.
Unit 9 Generations of integrated circuits
1. Read the text and answer the questions.
The first integrated circuits contained only a few transistors. Called "Small-Scale Integration" (SSI), digital circuits containing transistors numbering in the tens provided a few logic.
The next step in the development of integrated circuits, taken in the late 1960s, introduced devices which contained hundreds of transistors on each chip, called "Medium-Scale Integration" (MSI).
They were attractive economically because while they cost little more to produce than SSI devices, they allowed more complex systems to be produced using smaller circuit boards, less assembly work (because of fewer separate components), and a number of other advantages.
Further development, driven by the same economic factors, led to "Large-Scale Integration" (LSI) in the mid 1970s, with tens of thousands of transistors per chip.
Integrated circuits such as 1K-bit RAMs, calculator chips, and the first microprocessors, that began to be manufactured in moderate quantities in the early 1970s, had under 4000 transistors. True LSI circuits, approaching 10000 transistors, began to be produced around 1974, for computer main memories and second-generation microprocessors.
The final step in the development process, starting in the 1980s and continuing through the present, was "very large-scale integration" (VLSI). The development started with hundreds of thousands of transistors in the early 1980s, and continues beyond several billion transistors as of 2007.
There was no single breakthrough that allowed this increase in complexity, though many factors helped. Manufacturing moved to smaller rules and cleaner fabs, allowing them to produce chips with more transistors with adequate yield. The more energy efficient CMOS replaced NMOS and PMOS, avoiding a prohibitive increase in power consumption. Better texts such as the landmark textbook by Mead and Conway helped schools educate more designers, among other factors.
In 1986 the first one megabit RAM chips were introduced, which contained more than one million transistors. Microprocessor chips passed the million transistor mark in 1989 and the billion transistor mark in 2005. The trend continues largely unabated, with chips introduced in 2007 containing tens of billions of memory transistors.
To reflect further growth of the complexity, the term ULSI that stands for "Ultra-Large Scale Integration" was proposed for chips of complexity of more than 1 million transistors.
Wafer-scale integration (WSI) is a system of building very-large integrated circuits that uses an entire silicon wafer to produce a single "super-chip". Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers.
System-on-a-Chip (SoC or SOC) is an integrated circuit in which all the components needed for a computer or other system are included on a single chip. The design of such a device can be complex and costly, and building disparate components on a single piece of silicon may compromise the efficiency of some elements. However, these drawbacks are offset by lower manufacturing and assembly costs and by a greatly reduced power budget: because signals among the components are kept on-die, much less power is required.
Three Dimensional Integrated Circuit (3D-IC) has two or more layers of active electronic components that are integrated both vertically and horizontally into a single circuit. Communication between layers uses on-die signalling, so power consumption is much lower than in equivalent separate circuits.
Only a half century after their development was initiated, integrated circuits have become ubiquitous. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies. That is, modern computing, communications, manufacturing and transport systems, including the Internet, all depend on the existence of integrated circuits.
What did first integrated circuits look like?
How many transistors did MSI contain?
What circuits did computer main memories and second generation microprocessors use?
What is VLSI and ULSI?
What is wafer-scale integration?
What circuit can be called SOC?
What circuits have two or more layers of active electronic components?
Is modern society heavily dependent on IC? Why?