ATtiny2313/V
	Ordering Information
	Speed (MHz)(3)	Power Supply	Ordering Code	Package(1)	Operation Range
			ATtiny2313V-10PI	20P3
			ATtiny2313V-10PU(2)	20P3
	10	1.8 - 5.5V	ATtiny2313V-10SI	20S	Industrial
			ATtiny2313V-10SU(2)	20S	(-40°C to 85°C)
			ATtiny2313V-10MI	20M1
			ATtiny2313V-10MU(2)	20M1
			ATtiny2313-20PI	20P3
			ATtiny2313-20PU(2)	20P3
	20	2.7 - 5.5V	ATtiny2313-20SI	20S	Industrial
			ATtiny2313-20SU(2)	20S	(-40°C to 85°C)
			ATtiny2313-20MI	20M1
			ATtiny2313-20MU(2)	20M1

Note: 1.	This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
	and minimum quantities.
2.	Pb-free packaging alternative, complies to the European Directive for Restriction of Hazardous Substances (RoHS direc-
	tive).Also Halide free and fully Green.
3.	For Speed vs. VCC, see Figure 82 on page 180 and Figure 83 on page 180.

	Package Type
20P3	20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
20S	20-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (SOIC)
20M1	20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (MLF)

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Packaging Information

20P3

D

PIN 1

E1

A

SEATING PLANE

A1

L

B

B1

e

E

C

eC

eB

Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD.

2.Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL	MIN	NOM	MAX	NOTE
A	–	–	5.334
A1	0.381	–	–
D	25.493	–	25.984	Note 2
E	7.620	–	8.255
E1	6.096	–	7.112	Note 2
B	0.356	–	0.559
B1	1.270	–	1.551
L	2.921	–	3.810
C	0.203	–	0.356
eB	–	–	10.922
eC	0.000	–	1.524
e		2.540 TYP

1/12/04

TITLE

	2325 Orchard Parkway	20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual
	San Jose, CA 95131
R		Inline Package (PDIP)

DRAWING NO. REV.

20P3 C

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ATtiny2313/V

20S

C

1

E H

N

Top View

e

b

A

D

Side View

L

A1

End View

COMMON DIMENSIONS

(Unit of Measure = inches)

SYMBOL	MIN	NOM	MAX	NOTE
A	0.0926		0.1043
A1	0.0040		0.0118
b	0.0130		0.0200	4
C	0.0091		0.0125
D	0.4961		0.5118	1
E	0.2914		0.2992	2
H	0.3940		0.4190
L	0.0160		0.050	3
e	0.050 BSC

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-013, Variation AC for additional information.

2.Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006") per side.

3.Dimension "E" does not include inter-lead Flash or protrusion. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010") per side.

4."L" is the length of the terminal for soldering to a substrate.

5.The lead width "b", as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm

					(0.024") per side.			1/9/02
						TITLE	DRAWING NO.		REV.
					2325 Orchard Parkway	20S2, 20-lead, 0.300" Wide Body, Plastic Gull	20S2		A
					R San Jose, CA 95131	Wing Small Outline Package (SOIC)

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20M1

D

1

Pin 1 ID

2

3	E

TOP VIEW

D2

	1
Pin #1	2
Notch	3	E2
(0.20 R)

b

L

e

BOTTOM VIEW

Note: Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.

SIDE VIEW

A2

A1

A

0.08 C

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL	MIN	NOM	MAX NOTE
A	0.70	0.75	0.80
A1	–	0.01	0.05
A2		0.20 REF
b	0.18	0.23	0.30
D		4.00 BSC
D2	2.45	2.60	2.75
E		4.00 BSC
E2	2.45	2.60	2.75
e		0.50 BSC
L	0.35	0.40	0.55

TITLE

2325 Orchard Parkway 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, R San Jose, CA 95131 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)

10/27/04

DRAWING NO. REV.

20M1 A

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