- •Contents
- •Preface
- •1.1 Elementary thermodynamic ideas of surfaces
- •1.1.1 Thermodynamic potentials and the dividing surface
- •1.1.2 Surface tension and surface energy
- •1.1.3 Surface energy and surface stress
- •1.2 Surface energies and the Wulff theorem
- •1.2.1 General considerations
- •1.2.3 Wulff construction and the forms of small crystals
- •1.3 Thermodynamics versus kinetics
- •1.3.1 Thermodynamics of the vapor pressure
- •1.3.2 The kinetics of crystal growth
- •1.4 Introduction to surface and adsorbate reconstructions
- •1.4.1 Overview
- •1.4.2 General comments and notation
- •1.4.7 Polar semiconductors, such as GaAs(111)
- •1.5 Introduction to surface electronics
- •1.5.3 Surface states and related ideas
- •1.5.4 Surface Brillouin zone
- •1.5.5 Band bending, due to surface states
- •1.5.6 The image force
- •1.5.7 Screening
- •Further reading for chapter 1
- •Problems for chapter 1
- •2.1 Kinetic theory concepts
- •2.1.1 Arrival rate of atoms at a surface
- •2.1.2 The molecular density, n
- •2.2 Vacuum concepts
- •2.2.1 System volumes, leak rates and pumping speeds
- •2.2.2 The idea of conductance
- •2.2.3 Measurement of system pressure
- •2.3 UHV hardware: pumps, tubes, materials and pressure measurement
- •2.3.1 Introduction: sources of information
- •2.3.2 Types of pump
- •2.3.4 Choice of materials
- •2.3.5 Pressure measurement and gas composition
- •2.4.1 Cleaning and sample preparation
- •2.4.3 Sample transfer devices
- •2.4.4 From laboratory experiments to production processes
- •2.5.1 Historical descriptions and recent compilations
- •2.5.2 Thermal evaporation and the uniformity of deposits
- •2.5.3 Molecular beam epitaxy and related methods
- •2.5.4 Sputtering and ion beam assisted deposition
- •2.5.5 Chemical vapor deposition techniques
- •Further reading for chapter 2
- •Problems for chapter 2
- •3.1.1 Surface techniques as scattering experiments
- •3.1.2 Reasons for surface sensitivity
- •3.1.3 Microscopic examination of surfaces
- •3.1.4 Acronyms
- •3.2.1 LEED
- •3.2.2 RHEED and THEED
- •3.3 Inelastic scattering techniques: chemical and electronic state information
- •3.3.1 Electron spectroscopic techniques
- •3.3.2 Photoelectron spectroscopies: XPS and UPS
- •3.3.3 Auger electron spectroscopy: energies and atomic physics
- •3.3.4 AES, XPS and UPS in solids and at surfaces
- •3.4.2 Ratio techniques
- •3.5.1 Scanning electron and Auger microscopy
- •3.5.3 Towards the highest spatial resolution: (a) SEM/STEM
- •Further reading for chapter 3
- •Problems, talks and projects for chapter 3
- •4.2 Statistical physics of adsorption at low coverage
- •4.2.1 General points
- •4.2.2 Localized adsorption: the Langmuir adsorption isotherm
- •4.2.4 Interactions and vibrations in higher density adsorbates
- •4.3 Phase diagrams and phase transitions
- •4.3.1 Adsorption in equilibrium with the gas phase
- •4.3.2 Adsorption out of equilibrium with the gas phase
- •4.4 Physisorption: interatomic forces and lattice dynamical models
- •4.4.1 Thermodynamic information from single surface techniques
- •4.4.2 The crystallography of monolayer solids
- •4.4.3 Melting in two dimensions
- •4.4.4 Construction and understanding of phase diagrams
- •4.5 Chemisorption: quantum mechanical models and chemical practice
- •4.5.1 Phases and phase transitions of the lattice gas
- •4.5.4 Chemisorption and catalysis: macroeconomics, macromolecules and microscopy
- •Further reading for chapter 4
- •Problems and projects for chapter 4
- •5.1 Introduction: growth modes and nucleation barriers
- •5.1.1 Why are we studying epitaxial growth?
- •5.1.3 Growth modes and adsorption isotherms
- •5.1.4 Nucleation barriers in classical and atomistic models
- •5.2 Atomistic models and rate equations
- •5.2.1 Rate equations, controlling energies, and simulations
- •5.2.2 Elements of rate equation models
- •5.2.3 Regimes of condensation
- •5.2.4 General equations for the maximum cluster density
- •5.2.5 Comments on individual treatments
- •5.3 Metal nucleation and growth on insulating substrates
- •5.3.1 Microscopy of island growth: metals on alkali halides
- •5.3.2 Metals on insulators: checks and complications
- •5.4 Metal deposition studied by UHV microscopies
- •5.4.2 FIM studies of surface diffusion on metals
- •5.4.3 Energies from STM and other techniques
- •5.5 Steps, ripening and interdiffusion
- •5.5.2 Steps as sources: diffusion and Ostwald ripening
- •5.5.3 Interdiffusion in magnetic multilayers
- •Further reading for chapter 5
- •Problems and projects for chapter 5
- •6.1 The electron gas: work function, surface structure and energy
- •6.1.1 Free electron models and density functionals
- •6.1.2 Beyond free electrons: work function, surface structure and energy
- •6.1.3 Values of the work function
- •6.1.4 Values of the surface energy
- •6.2 Electron emission processes
- •6.2.1 Thermionic emission
- •6.2.4 Secondary electron emission
- •6.3.1 Symmetry, symmetry breaking and phase transitions
- •6.3.3 Magnetic surface techniques
- •6.3.4 Theories and applications of surface magnetism
- •Further reading for chapter 6
- •Problems and projects for chapter 6
- •7.1.1 Bonding in diamond, graphite, Si, Ge, GaAs, etc.
- •7.1.2 Simple concepts versus detailed computations
- •7.2 Case studies of reconstructed semiconductor surfaces
- •7.2.2 GaAs(111), a polar surface
- •7.2.3 Si and Ge(111): why are they so different?
- •7.2.4 Si, Ge and GaAs(001), steps and growth
- •7.3.1 Thermodynamic and elasticity studies of surfaces
- •7.3.2 Growth on Si(001)
- •7.3.3 Strained layer epitaxy: Ge/Si(001) and Si/Ge(001)
- •7.3.4 Growth of compound semiconductors
- •Further reading for chapter 7
- •Problems and projects for chapter 7
- •8.1 Metals and oxides in contact with semiconductors
- •8.1.1 Band bending and rectifying contacts at semiconductor surfaces
- •8.1.2 Simple models of the depletion region
- •8.1.3 Techniques for analyzing semiconductor interfaces
- •8.2 Semiconductor heterojunctions and devices
- •8.2.1 Origins of Schottky barrier heights
- •8.2.2 Semiconductor heterostructures and band offsets
- •8.3.1 Conductivity, resistivity and the relaxation time
- •8.3.2 Scattering at surfaces and interfaces in nanostructures
- •8.3.3 Spin dependent scattering and magnetic multilayer devices
- •8.4 Chemical routes to manufacturing
- •8.4.4 Combinatorial materials development and analysis
- •Further reading for chapter 8
- •9.1 Electromigration and other degradation effects in nanostructures
- •9.2 What do the various disciplines bring to the table?
- •9.3 What has been left out: future sources of information
- •References
- •Index
5.5 Steps, ripening and interdiffusion |
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pressed Ag(111). Other Ostwald ripening experiments of a similar nature have yielded Q5 0.766 0.04 eV and ES 5 0.226 0.01 eV for adatoms on Cu(111) (Giesen & Ibach 1999). These authors and their co-workers have also observed step ¯uctuations, and rapid decay processes when multilayer islands coalesce, and have recently invoked electronic mechanisms in explanation. Thus, as we have seen in the previous two sections, research on atomistic processes at metal surfaces has encountered the need for elec- tronic structure calculations in the search for complete explanation. The background needed for this understanding is given in section 6.1.
5.5.3Interdiffusion in magnetic multilayers
Magnetic multilayers are typically formed by interspersing a magnetic metal (Fe, Ni, Co, Cr, etc.) with a non-magnetic spacer, often a noble metal (Cu, Ag, Au, Pt etc.). The sequence Co/Cu/Co . . . for example has a giant magnetoresistance whose properties are controlled by the various layer thicknesses and perfection; there are many such systems, whose properties have been extensively reviewed in the last few years, as discussed later in sections 6.3 and 8.3. In this section we concentrate on the growth mode, taking Fe/Ag/Fe(110) as the example.
As described in section 5.4.1, Ag/Fe(110) is a typical SK growth system, with two layers before islands form, the ®rst of which has the c531 structure, which has a nominal coverage of 0.8ML, and the second is close to a compact Ag(111) layer. Auger amplitudes from this structure have been measured (Noro et al. 1995, Venables et al. 1996, Venables & Persaud 1997); there is nothing unusual about the Ag/Fe(110) interface. However, deposition of Fe on thin ®lms of Ag/Fe(110) results in some interdiVusion, the extent of which depends on the Ag ®lm thickness, deposition and annealing conditions. An example is shown in ®gure 5.21, where the ratio of Ag/Fe AES intensities is plotted against Fe coverage, and is compared with a layer growth calculation (Persaud et al. 1998).
The lower curves are calculated assuming no surface segregation, the two curves re¯ecting some uncertainty in the correct inelastic mean free path for the Auger electrons. For deposits of under 1 ML at room temperature, the data follow this layer growth curve, more or less. But between 1 and 2 ML, there is clearly some segregation, where the calculation assumes that all of the ®rst 0.8 ML Ag has moved to the surface; this is clearly not a bad approximation. But annealing to around 250°C results in more segregation, and deposition at 250°C results in almost complete segregation. Results for other Ag layer thicknesses show a similar trend: interdiVusion at the ML level proceeds even at room temperature, and there is long range interdiVusion already at a few hundred degrees Celsius.
From the arguments given in section 5.1.1, we can see that metal deposition systems should follow the island growth mode, if the surface energy of the deposit (Fe ,2.9 J/m2) is greater than that of the substrate (Ag ,1.2 J/m2); surface energy values are
discussed and tabulated in section 6.1.4. Thus islands of the strongly bound material, Fe, once formed, could lower their energy by allowing themselves to be coated with a thin skin of Ag substrate material! This corresponds to a curious form of
180 5 Surface processes in epitaxial growth
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SUBSTRATE: 1.8ML Ag/Fe(110) |
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SUBSTRATE: 5ML Ag/Fe(110) |
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RT deposition |
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RT deposition |
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Calculation |
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Fe coverage (ML) |
Fe coverage (ML) |
Figure 5.21. AES deposition curves for Fe/1.8 ML Ag/Fe(110), showing (a) rearrangement of the Ag layer between 1 and 2ML, and segregation on annealing, or during deposition at elevated temperature. The Fe/5 ML Ag/Fe(110) curves (b) show rather less complete segregation. The parameter p is the amount interchanged with the surface in the model (Persaud et al. 1998, reproduced with permission).
interdiVusion, in which islands or layers, rather than single atoms, bury themselves in (i.e. burrow into) the substrate. At low temperatures this will not happen, because the substrate atoms will not diVuse. However, STM studies of surface steps on noble metals have shown that steps can move quite rapidly, even at room temperature (Poensgen et al. 1992) and burying of deposited clusters has been observed by in situ TEM at elevated temperatures (Zimmerman et al. 1999). It is now clear that the diYculties various groups have experienced in producing well-de®ned thin ®lms of magnetic metals on noble metal surfaces are related to eVects of this nature. Such magnetic metals generally have higher surface energies than the substrates; they also undergo structural phase changes with increasing thickness; the magnetic features are discussed in sections 6.3 and 8.3.
One case which has been studied by STM is Ni/Ag(111) (Meyer & Behm 1995). Here Ni can both diVuse by hopping over the surface, or, at higher temperature, can exchange with a silver atom. This immobile Ni atom now acts as a nucleus for further growth of Ni clusters. In a ®xed temperature deposition, this corresponds to creation of nuclei at a rate proportional to the adatom concentration; if the Ni±Ni bond is strong enough, then i50. Similar cases are Fe, Co and Ni/Au(111), with a complex