- •Contents
- •Preface
- •1.1 Elementary thermodynamic ideas of surfaces
- •1.1.1 Thermodynamic potentials and the dividing surface
- •1.1.2 Surface tension and surface energy
- •1.1.3 Surface energy and surface stress
- •1.2 Surface energies and the Wulff theorem
- •1.2.1 General considerations
- •1.2.3 Wulff construction and the forms of small crystals
- •1.3 Thermodynamics versus kinetics
- •1.3.1 Thermodynamics of the vapor pressure
- •1.3.2 The kinetics of crystal growth
- •1.4 Introduction to surface and adsorbate reconstructions
- •1.4.1 Overview
- •1.4.2 General comments and notation
- •1.4.7 Polar semiconductors, such as GaAs(111)
- •1.5 Introduction to surface electronics
- •1.5.3 Surface states and related ideas
- •1.5.4 Surface Brillouin zone
- •1.5.5 Band bending, due to surface states
- •1.5.6 The image force
- •1.5.7 Screening
- •Further reading for chapter 1
- •Problems for chapter 1
- •2.1 Kinetic theory concepts
- •2.1.1 Arrival rate of atoms at a surface
- •2.1.2 The molecular density, n
- •2.2 Vacuum concepts
- •2.2.1 System volumes, leak rates and pumping speeds
- •2.2.2 The idea of conductance
- •2.2.3 Measurement of system pressure
- •2.3 UHV hardware: pumps, tubes, materials and pressure measurement
- •2.3.1 Introduction: sources of information
- •2.3.2 Types of pump
- •2.3.4 Choice of materials
- •2.3.5 Pressure measurement and gas composition
- •2.4.1 Cleaning and sample preparation
- •2.4.3 Sample transfer devices
- •2.4.4 From laboratory experiments to production processes
- •2.5.1 Historical descriptions and recent compilations
- •2.5.2 Thermal evaporation and the uniformity of deposits
- •2.5.3 Molecular beam epitaxy and related methods
- •2.5.4 Sputtering and ion beam assisted deposition
- •2.5.5 Chemical vapor deposition techniques
- •Further reading for chapter 2
- •Problems for chapter 2
- •3.1.1 Surface techniques as scattering experiments
- •3.1.2 Reasons for surface sensitivity
- •3.1.3 Microscopic examination of surfaces
- •3.1.4 Acronyms
- •3.2.1 LEED
- •3.2.2 RHEED and THEED
- •3.3 Inelastic scattering techniques: chemical and electronic state information
- •3.3.1 Electron spectroscopic techniques
- •3.3.2 Photoelectron spectroscopies: XPS and UPS
- •3.3.3 Auger electron spectroscopy: energies and atomic physics
- •3.3.4 AES, XPS and UPS in solids and at surfaces
- •3.4.2 Ratio techniques
- •3.5.1 Scanning electron and Auger microscopy
- •3.5.3 Towards the highest spatial resolution: (a) SEM/STEM
- •Further reading for chapter 3
- •Problems, talks and projects for chapter 3
- •4.2 Statistical physics of adsorption at low coverage
- •4.2.1 General points
- •4.2.2 Localized adsorption: the Langmuir adsorption isotherm
- •4.2.4 Interactions and vibrations in higher density adsorbates
- •4.3 Phase diagrams and phase transitions
- •4.3.1 Adsorption in equilibrium with the gas phase
- •4.3.2 Adsorption out of equilibrium with the gas phase
- •4.4 Physisorption: interatomic forces and lattice dynamical models
- •4.4.1 Thermodynamic information from single surface techniques
- •4.4.2 The crystallography of monolayer solids
- •4.4.3 Melting in two dimensions
- •4.4.4 Construction and understanding of phase diagrams
- •4.5 Chemisorption: quantum mechanical models and chemical practice
- •4.5.1 Phases and phase transitions of the lattice gas
- •4.5.4 Chemisorption and catalysis: macroeconomics, macromolecules and microscopy
- •Further reading for chapter 4
- •Problems and projects for chapter 4
- •5.1 Introduction: growth modes and nucleation barriers
- •5.1.1 Why are we studying epitaxial growth?
- •5.1.3 Growth modes and adsorption isotherms
- •5.1.4 Nucleation barriers in classical and atomistic models
- •5.2 Atomistic models and rate equations
- •5.2.1 Rate equations, controlling energies, and simulations
- •5.2.2 Elements of rate equation models
- •5.2.3 Regimes of condensation
- •5.2.4 General equations for the maximum cluster density
- •5.2.5 Comments on individual treatments
- •5.3 Metal nucleation and growth on insulating substrates
- •5.3.1 Microscopy of island growth: metals on alkali halides
- •5.3.2 Metals on insulators: checks and complications
- •5.4 Metal deposition studied by UHV microscopies
- •5.4.2 FIM studies of surface diffusion on metals
- •5.4.3 Energies from STM and other techniques
- •5.5 Steps, ripening and interdiffusion
- •5.5.2 Steps as sources: diffusion and Ostwald ripening
- •5.5.3 Interdiffusion in magnetic multilayers
- •Further reading for chapter 5
- •Problems and projects for chapter 5
- •6.1 The electron gas: work function, surface structure and energy
- •6.1.1 Free electron models and density functionals
- •6.1.2 Beyond free electrons: work function, surface structure and energy
- •6.1.3 Values of the work function
- •6.1.4 Values of the surface energy
- •6.2 Electron emission processes
- •6.2.1 Thermionic emission
- •6.2.4 Secondary electron emission
- •6.3.1 Symmetry, symmetry breaking and phase transitions
- •6.3.3 Magnetic surface techniques
- •6.3.4 Theories and applications of surface magnetism
- •Further reading for chapter 6
- •Problems and projects for chapter 6
- •7.1.1 Bonding in diamond, graphite, Si, Ge, GaAs, etc.
- •7.1.2 Simple concepts versus detailed computations
- •7.2 Case studies of reconstructed semiconductor surfaces
- •7.2.2 GaAs(111), a polar surface
- •7.2.3 Si and Ge(111): why are they so different?
- •7.2.4 Si, Ge and GaAs(001), steps and growth
- •7.3.1 Thermodynamic and elasticity studies of surfaces
- •7.3.2 Growth on Si(001)
- •7.3.3 Strained layer epitaxy: Ge/Si(001) and Si/Ge(001)
- •7.3.4 Growth of compound semiconductors
- •Further reading for chapter 7
- •Problems and projects for chapter 7
- •8.1 Metals and oxides in contact with semiconductors
- •8.1.1 Band bending and rectifying contacts at semiconductor surfaces
- •8.1.2 Simple models of the depletion region
- •8.1.3 Techniques for analyzing semiconductor interfaces
- •8.2 Semiconductor heterojunctions and devices
- •8.2.1 Origins of Schottky barrier heights
- •8.2.2 Semiconductor heterostructures and band offsets
- •8.3.1 Conductivity, resistivity and the relaxation time
- •8.3.2 Scattering at surfaces and interfaces in nanostructures
- •8.3.3 Spin dependent scattering and magnetic multilayer devices
- •8.4 Chemical routes to manufacturing
- •8.4.4 Combinatorial materials development and analysis
- •Further reading for chapter 8
- •9.1 Electromigration and other degradation effects in nanostructures
- •9.2 What do the various disciplines bring to the table?
- •9.3 What has been left out: future sources of information
- •References
- •Index
301 Introduction to surface processes
again is a specialist topic, combining surface structure with surface electronics, that we consider in chapter 7.
1.4.8Ionic crystal structures, such as NaCl, CaF2, MgO or alumina
Here we have to consider the movement of the two diVerent charged ions, likely to be in opposite directions, and the resulting charge balance in the presence of the dielectric substrate. However, this `rumpling' is often found to be remarkably small, typically a few percent of the interplanar spacing; a ®rst point for a search of what is known experimentally and theoretically is the book by Henrich & Cox (1996). A recent development is to combine structural experiments (e.g. LEED) on ultra-thin ®lms grown on conducting substrates, to avoid problems of charging, with ab initio calculation. Some of these methods and results can be found in the atlas of Watson et al. (1996), review chapters in King & WoodruV (1997) and a 1999 conference proceedings on The Surface Science of Metal Oxides published as Faraday Disc. Chem. Soc. 114. Grazing incidence X-ray scattering is also helping to determine structures (Renaud 1998). A notable
exception to the general rule is alumina (A12O3), where the surface oxygen ion relaxations have been calculated to reach around 50% of the layer spacing on the hexagonal
(0001) face (Verdozzi et al. 1999). But are we getting ahead of ourselves: you can see how soon we need to read the original literature, but we do need some more background ®rst!
1.5Introduction to surface electronics
Here we are concerned only to de®ne and understand a few terms which will be used in a general context. The terms which we will need include the following.
1.5.1Work function, f
The work function is the energy, typically a few electronvolts, required to move an elec-
tron from the Fermi Level, EF, to the vacuum level, E0, as shown in ®gure 1.21(a). The work function depends on the crystal face {hkl} and rough surfaces typically have lower f, as discussed later in section 6.1.
1.5.2Electron af®nity, x, and ionization potential F
Both of these would be the same for a metal, and equal to f. But for a semiconductor or insulator, they are diVerent. The electron aYnity x is the diVerence between the
vacuum level E0, and the bottom of the conduction band EC, as shown in ®gure 1.21(b). The ionization potential F is E0 2 EV, where EV is the top of the valence band. These terms are not speci®c to surfaces: they are also used for atoms and molecules generally,
as the energy level which (a) the next electron goes into, and (b) the last electron comes from.
1.5 Introduction to surface electronics |
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Figure 1.21. Schematic diagrams of (a) the work function, f; (b) the electron aYnity, x and ionization potential F, both in relation to the vacuum level E0, the Fermi energy EF, and conduction and valence band edges EC and EV.
Figure 1.22. Schematic diagrams of: (a) a surface state de®ned by wave vector k//5kx1ky, and k'5kz; (b) the surface Brillouin zone and 2D reciprocal lattice vector G// for the Î33Î3R30° structure, plotted in the same orientation as the real (xenon) lattice of ®gure 1.16.
1.5.3Surface states and related ideas
A surface state is a state localized at the surface, which decays exponentially into the bulk, but which may travel along the surface. The wave function is typically of the form
c < u(r)exp (2 i k' |z|) exp (i k// r), |
(1.18) |
where, for a state in the band gap, k' is complex, decaying away from the surface on both sides, as shown in ®gure 1.22(a). Such a state is called a resonance if it overlaps with a bulk band, as then it may have an increased amplitude at the surface, but evolves continuously into a bulk state. A surface plasmon is a collective excitation located at the surface, with frequency typically vp/Î2, where vp is the frequency of a bulk plasmon.
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1 Introduction to surface processes |
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Figure 1.23. Schematic diagrams of: (a) band bending due to a surface state on a p-type semiconductor; (b) the E-®eld between an electron at position z and a metal surface is the same as that produced by a positive image charge at 2 z.
1.5.4Surface Brillouin zone
A surface state takes the form of a Bloch wave in the two dimensions of the surface, in
which there can be energy dispersion as a function of the k// vector. For electrons crossing the surface barrier, k// is conserved, k' is not. The k// conservation is to within a 2D reciprocal lattice vector, i.e. 6 G//. This is the theoretical basis of (electron and other) diVraction from surfaces. For electrons there are two states contained in the surface Brillouin zone, which is illustrated for the hexagonal lattice of the Î33Î3R30° struc-
ture in ®gure 1.22(b).
1.5.5Band bending, due to surface states
In a semiconductor, the bands can be bent near the surface due to surface states. Under zero bias, the Fermi level has to be `level', and this level typically goes through the surface states which lie in the band gap. Thus one can convince oneself that a p-type semiconductor has bands that are bent downwards as the surface is approached from inside the material, as shown in ®gure 1.23(a). This leads to a reduction in the electron aYnity. Some materials (e.g. Cs/p-type GaAs) can even be activated to negative electron aYnity, and such NEA materials form a potent source of electrons, which can also be spin-polarized as a result of the band structure.
1.5.6The image force
You will recall from elementary electrostatics that a charge outside a conducting plane has a ®eld on it equivalent to that produced by a ®ctitious image charge, as sketched in ®gure 1.23(b). The corresponding potential felt by the electron, V(z)52 e/4z. For a die-
lectric, with permitivity «, there is also a (reduced) potential V(z)52(e/4z) («21)/ («1 1). It is often useful to think of metals as the limit «→`, and vacuum as « →1. Typical semiconductors have «,10, with «511.7 for Si and 16 for Ge; so semiconductors and
metals are fairly similar as far as dielectric response is concerned, even though they are not at all similar in respect of electrical conductivity.