Electrical Characteristics

Absolute Maximum Ratings*

..................................Operating Temperature					-55°C to +125°C	*NOTICE: Stresses beyond those listed under “Absolute
						Maximum Ratings” may cause permanent dam-
Storage Temperature .....................................					-65°C to +150°C	age to the device. This is a stress rating only and
						functional operation of the device at these or
Voltage on any Pin except			RESET			other conditions beyond those indicated in the
with respect to Ground ................................					- 1.0V to VCC+0.5V	operational sections of this specification is not
Voltage on		with respect to Ground			-1.0V to +13.0V	implied. Exposure to absolute maximum rating
	RESET					conditions for extended periods may affect
Maximum Operating Voltage					6.0V	device reliability.
DC Current per I/O Pin ...............................................					40.0 mA
DC Current VCC and GND Pins................................					200.0 mA

DC Characteristics TA = -20°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted)(1)

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

VIL

Input Low Voltage

-0.5

0.2VCC

V

(3)

VIH

Input High-voltage

Except RESET pin

0.6VCC

VCC +0.5

V

(3)

VIH2

Input High-voltage

RESET pin

0.9VCC

VCC +0.5

V

VOL

Output Low Voltage(4)

I

OL

= 10 mA, V

CC

= 5V

0.6

V

(Port B)

IOL = 5 mA, VCC = 3V

0.5

V

VOH

Output High-voltage(5)

I

OH

= -10 mA, V

CC

= 5V

4.3

V

(Port B)

IOH = -5 mA, VCC = 3V

2.5

V

IIL

Input Leakage

Vcc = 5.5V, pin low

8

µA

Current I/O Pin

(absolute value)

IIH

Input Leakage

Vcc = 5.5V, pin high

8

µA

Current I/O Pin

(absolute value)

RRST

Reset Pull-up Resistor

20

100

kΩ

Rpu

I/O Pin Pull-up Resistor

20

100

kΩ

Active 1MHz, VCC = 2V

0.55

mA

Active 4MHz, VCC = 3V

3.5

mA

Power Supply Current

Active 8MHz, VCC = 5V

12

mA

ICC

Idle 1MHz, VCC = 2V

0.08

0.25

mA

Idle 4MHz, VCC = 3V

0.41

1.5

mA

Idle 8MHz, VCC = 5V

1.6

5.5

mA

Power-down mode

WDT enabled, VCC = 3V

< 5

16

µA

WDT disabled, VCC = 3V

< 0.5

8

µA

Notes: 1. All DC Characteristics contained in this data sheet are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are preliminary values representing design targets, and will be updated after characterization of actual silicon.

2.“Max” means the highest value where the pin is guaranteed to be read as low.

3.“Min” means the lowest value where the pin is guaranteed to be read as high.

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ATtiny13

4.Although each I/O port can sink more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed:

1] The sum of all IOL, for all ports, should not exceed 60 mA.

If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition.

5.Although each I/O port can source more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed:

1] The sum of all IOH, for all ports, should not exceed 60 mA.

If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition.

External Clock Drive Waveforms

Figure 60. External Clock Drive Waveforms

VIH1

VIL1

External Clock Drive

Table 58. External Clock Drive

		VCC = 1.8 - 5.5V		VCC = 2.7 - 5.5V		VCC = 4.5 - 5.5V
Symbol	Parameter	Min.	Max.	Min.	Max.	Min.	Max.	Units
1/tCLCL	Clock Frequency	0	TBD	0	TBD	0	TBD	MHz
tCLCL	Clock Period	TBD		TBD		TBD		ns
tCHCX	High Time	TBD		TBD		TBD		ns
tCLCX	Low Time	TBD		TBD		TBD		ns
tCLCH	Rise Time		TBD		TBD		TBD	s
tCHCL	Fall Time		TBD		TBD		TBD	s
∆ tCLCL	Change in period from one clock cycle to the next		2		2		2	%

Figure 61. Maximum Frequency vs. VCC

16 MHz

9,6 MHz

Safe Operating

Area

2 MHz

1.8V

2.7V

4.5V

5.5V

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ADC Characteristics – Preliminary Data

Table 59.	ADC Characteristics
Symbol	Parameter	Condition	Min	Typ	Max	Units
	Resolution	Single Ended Conversion		10		Bits
		Differential Conversion		8		Bits
		Single Ended Conversion
		VREF = 4V, VCC = 4V,		2	2.5	LSB
		ADC clock = 200 kHz
		Single Ended Conversion
		VREF = 4V, VCC = 4V,		4.5		LSB
	Absolute accuracy (Including	ADC clock = 1 MHz
		Single Ended Conversion
	INL, DNL, quantization error,
		VREF = 4V, VCC = 4V,
	gain and offset error)			2		LSB
		ADC clock = 200 kHz
		Noise Reduction Mode
		Single Ended Conversion
		VREF = 4V, VCC = 4V,		4.5		LSB
		ADC clock = 1 MHz
		Noise Reduction Mode
		Single Ended Conversion
	Integral Non-linearity (INL)	VREF = 4V, VCC = 4V,		0.5		LSB
		ADC clock = 200 kHz
		Single Ended Conversion
	Differential Non-linearity (DNL)	VREF = 4V, VCC = 4V,		0.25		LSB
		ADC clock = 200 kHz
		Single Ended Conversion
	Gain Error	VREF = 4V, VCC = 4V,		2		LSB
		ADC clock = 200 kHz
		Single Ended Conversion
	Offset Error	VREF = 4V, VCC = 4V,		2		LSB
		ADC clock = 200 kHz
	Conversion Time	Free Running Conversion	13		260	µs
	Clock Frequency	Single Ended Conversion	50		1000	kHz
AVCC	Analog Supply Voltage		VCC - 0.3		VCC + 0.3	V
VREF	Reference Voltage	Single Ended Conversion	1.0		AVCC	V
		Differential Conversion	1.0		AVCC - 0.5	V
VIN	Input Voltage	Single ended channels	GND		VREF	V
		Differential Conversion	0		AVCC(1)	V
	Input Bandwidth	Single Ended Channels		38,5		kHz
		Differential Channels		4		kHz
VINT	Internal Voltage Reference		1.0	1.1	1.2	V
RREF	Reference Input Resistance			32		kΩ
RAIN	Analog Input Resistance			100		MΩ
Note: 1.	VDIFF must be below VREF

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ATtiny13 Typical

Characteristics –

Preliminary Data

Active Supply Current

The data contained in this section is largely based on simulations and characterization of similar devices in the same process and design methods. Thus, the data should be treated as indications of how the part will behave.

The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with rail- to-rail output is used as clock source.

The power consumption in Power-down mode is independent of clock selection.

The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency.

The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin.

The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates.

The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer.

Figure 62. Active Supply Current vs. Frequency (0.1 - 1.0 MHz)

ACTIVE SUPPLY CURRENT vs. FREQUENCY

						0.1 - 1.0 MHz
	2
	1.8										5.5V
	1.6										5.0V
	1.4										4.5V
(mA)	1.2										4.0V
	1										3.3V
CC
I	0.8
											2.7V
	0.6
	0.4										1.8V
	0.2
	0
	0	0.1	0.2	0.3	0.4	0.5	0.6	0.7	0.8	0.9	1

Frequency (MHz)

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Figure 63. Active Supply Current vs. Frequency (1 - 16 MHz)

ACTIVE SUPPLY CURRENT vs. FREQUENCY

						1 - 16 MHz
	15
											5.5V
	12.5										5.0V
	10										4.5V
(mA)	7									4.0V
CC
I
	5							3.3V
	2.5					2.7V
	0			1.8V
	0	2	4	6	8	10	12	14	16	18	20

Frequency (MHz)

Figure 64. Active Supply Current vs. VCC (Internal RC Oscillator, 9.6 Mhz)

ACTIVE SUPPLY CURRENT vs. VCC

INTERNAL RC OSCILLATOR, 9.6 MHz

	14
	12								85°C
									25°C
	10								-40°C
(mA)	8
CC	6
I
	4
	2
	0
	1.5	2	2.5	3	3.5	4	4.5	5	5.5
					VCC (V)

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