- •Features
- •1. Pin Configurations
- •1.1 Disclaimer
- •2. Overview
- •2.1 Block Diagram
- •2.2 Pin Descriptions
- •2.2.3 Port B (PB5..PB0)
- •2.2.4 RESET
- •3. About Code Examples
- •4. AVR CPU Core
- •4.1 Introduction
- •4.2 Architectural Overview
- •4.4 Status Register
- •4.5 General Purpose Register File
- •4.6 Stack Pointer
- •4.7 Instruction Execution Timing
- •4.8 Reset and Interrupt Handling
- •4.8.1 Interrupt Response Time
- •5. AVR ATtiny25/45/85 Memories
- •5.2 SRAM Data Memory
- •5.2.1 Data Memory Access Times
- •5.3 EEPROM Data Memory
- •5.3.1 EEPROM Read/Write Access
- •5.3.5 Atomic Byte Programming
- •5.3.6 Split Byte Programming
- •5.3.7 Erase
- •5.3.8 Write
- •5.3.9 Preventing EEPROM Corruption
- •5.4 I/O Memory
- •6. System Clock and Clock Options
- •6.1 Clock Systems and their Distribution
- •6.2 Clock Sources
- •6.3 Default Clock Source
- •6.4 Crystal Oscillator
- •6.6 Calibrated Internal RC Oscillator
- •6.7 External Clock
- •6.8 128 kHz Internal Oscillator
- •6.9 Clock Output Buffer
- •6.10 System Clock Prescaler
- •6.10.2 Switching Time
- •7. Power Management and Sleep Modes
- •7.1 Idle Mode
- •7.2 ADC Noise Reduction Mode
- •7.4 Power Reduction Register
- •7.5 Minimizing Power Consumption
- •7.5.1 Analog to Digital Converter
- •7.5.2 Analog Comparator
- •7.5.4 Internal Voltage Reference
- •7.5.5 Watchdog Timer
- •7.5.6 Port Pins
- •8. System Control and Reset
- •8.0.1 Resetting the AVR
- •8.0.2 Reset Sources
- •8.0.3 Power-on Reset
- •8.0.4 External Reset
- •8.0.6 Watchdog Reset
- •8.1 Internal Voltage Reference
- •8.2 Watchdog Timer
- •8.3 Timed Sequences for Changing the Configuration of the Watchdog Timer
- •8.3.1 Safety Level 1
- •8.3.2 Safety Level 2
- •9. Interrupts
- •9.1 Interrupt Vectors in ATtiny25/45/85
- •10. External Interrupts
- •11. I/O Ports
- •11.1 Introduction
- •11.2 Ports as General Digital I/O
- •11.2.1 Configuring the Pin
- •11.2.2 Toggling the Pin
- •11.2.3 Switching Between Input and Output
- •11.2.4 Reading the Pin Value
- •11.2.5 Digital Input Enable and Sleep Modes
- •11.2.6 Unconnected Pins
- •11.3 Alternate Port Functions
- •11.3.2 Alternate Functions of Port B
- •12. 8-bit Timer/Counter0 with PWM
- •12.1 Overview
- •12.1.1 Registers
- •12.1.2 Definitions
- •12.2 Timer/Counter Clock Sources
- •12.3 Counter Unit
- •12.4 Output Compare Unit
- •12.4.1 Force Output Compare
- •12.4.2 Compare Match Blocking by TCNT0 Write
- •12.4.3 Using the Output Compare Unit
- •12.5 Compare Match Output Unit
- •12.5.1 Compare Output Mode and Waveform Generation
- •12.6 Modes of Operation
- •12.6.1 Normal Mode
- •12.6.2 Clear Timer on Compare Match (CTC) Mode
- •12.6.3 Fast PWM Mode
- •12.6.4 Phase Correct PWM Mode
- •12.7 Timer/Counter Timing Diagrams
- •13. Timer/Counter Prescaler
- •13.0.1 Prescaler Reset
- •13.0.2 External Clock Source
- •14. 8-bit Timer/Counter1
- •14.1 Timer/Counter1
- •14.1.1 Timer/Counter1 Control Register - TCCR1
- •14.1.2 General Timer/Counter1 Control Register - GTCCR
- •14.1.3 Timer/Counter1 - TCNT1
- •14.1.4 Timer/Counter1 Output Compare RegisterA - OCR1A
- •14.1.5 Timer/Counter1 Output Compare RegisterB - OCR1B
- •14.1.6 Timer/Counter1 Output Compare RegisterC - OCR1C
- •14.1.7 Timer/Counter Interrupt Mask Register - TIMSK
- •14.1.8 Timer/Counter Interrupt Flag Register - TIFR
- •14.1.9 PLL Control and Status Register - PLLCSR
- •14.1.10 Timer/Counter1 Initialization for Asynchronous Mode
- •14.1.11 Timer/Counter1 in PWM Mode
- •15. 8-bit Timer/Counter1 in ATtiny15 Mode
- •15.1 Timer/Counter1 Prescaler
- •15.2 Timer/Counter1
- •15.2.1 Timer/Counter1 Control Register - TCCR1
- •15.2.2 General Timer/Counter1 Control Register - GTCCR
- •15.2.3 Timer/Counter1 - TCNT1
- •15.2.4 Timer/Counter1 Output Compare RegisterA - OCR1A
- •15.2.5 Timer/Counter1 Output Compare Register C - OCR1C
- •15.2.6 Timer/Counter1 Interrupt Mask Register - TIMSK
- •15.2.7 Timer/Counter Interrupt Flag Register - TIFR
- •15.2.8 PLL Control and Status Register - PLLCSR
- •15.2.9 Timer/Counter1 in PWM Mode
- •16. Dead Time Generator
- •16.0.1 Timer/Counter1 Dead Time Prescaler register 1 - DTPS1
- •16.0.2 Timer/Counter1 Dead Time A - DT1A
- •16.0.3 Timer/Counter1 Dead Time B - DT1B
- •17.1 Overview
- •17.2 Functional Descriptions
- •17.2.2 SPI Master Operation Example
- •17.2.3 SPI Slave Operation Example
- •17.2.5 Start Condition Detector
- •17.3 Alternative USI Usage
- •17.3.4 Edge Triggered External Interrupt
- •17.3.5 Software Interrupt
- •17.4 USI Register Descriptions
- •18. Analog Comparator
- •18.1 Analog Comparator Multiplexed Input
- •19. Analog to Digital Converter
- •19.1 Features
- •19.2 Operation
- •19.3 Starting a Conversion
- •19.4 Prescaling and Conversion Timing
- •19.5 Changing Channel or Reference Selection
- •19.5.1 ADC Input Channels
- •19.5.2 ADC Voltage Reference
- •19.6 ADC Noise Canceler
- •19.6.1 Analog Input Circuitry
- •19.6.2 Analog Noise Canceling Techniques
- •19.6.3 ADC Accuracy Definitions
- •19.7 ADC Conversion Result
- •19.7.1 Single Ended Conversion
- •19.7.2 Unipolar Differential Conversion
- •19.7.3 Bipolar Differential Conversion
- •19.7.4 Temperature Measurement (Preliminary description)
- •19.7.7.1 ADLAR = 0
- •19.7.7.2 ADLAR = 1
- •20. debugWIRE On-chip Debug System
- •20.1 Features
- •20.2 Overview
- •20.3 Physical Interface
- •20.4 Software Break Points
- •20.5 Limitations of debugWIRE
- •20.6 debugWIRE Related Register in I/O Memory
- •21. Self-Programming the Flash
- •21.0.1 Performing Page Erase by SPM
- •21.0.2 Filling the Temporary Buffer (Page Loading)
- •21.0.3 Performing a Page Write
- •21.1.2 EEPROM Write Prevents Writing to SPMCSR
- •21.1.3 Reading the Fuse and Lock Bits from Software
- •21.1.4 Preventing Flash Corruption
- •21.1.5 Programming Time for Flash when Using SPM
- •22. Memory Programming
- •22.1 Program And Data Memory Lock Bits
- •22.2 Fuse Bytes
- •22.2.1 Latching of Fuses
- •22.3 Signature Bytes
- •22.3.1 ATtiny25 Signature Bytes
- •22.3.2 ATtiny45 Signature Bytes
- •22.3.3 ATtiny85 Signature Bytes
- •22.4 Calibration Byte
- •22.5 Page Size
- •22.6 Serial Downloading
- •22.6.1 Serial Programming Algorithm
- •22.6.2 Serial Programming Characteristics
- •22.7 High-voltage Serial Programming
- •22.8.2 Considerations for Efficient Programming
- •22.8.3 Chip Erase
- •22.8.4 Programming the Flash
- •22.8.5 Programming the EEPROM
- •22.8.6 Reading the Flash
- •22.8.7 Reading the EEPROM
- •22.8.8 Programming and Reading the Fuse and Lock Bits
- •22.8.9 Reading the Signature Bytes and Calibration Byte
- •23. Electrical Characteristics
- •23.1 Absolute Maximum Ratings*
- •23.2 External Clock Drive Waveforms
- •23.3 External Clock Drive
- •25. Register Summary
- •26. Instruction Set Summary
- •27. Ordering Information
- •27.1 ATtiny25
- •27.2 ATtiny45
- •27.3 ATtiny85
- •28. Packaging Information
- •29. Errata
- •29.1 ATtiny25/45/85 Rev. A
- •30. Datasheet Revision History
- •Table of Contents
28. Packaging Information
28.18P3
1 |
E |
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E1
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N |
Top View |
c |
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eA |
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End View |
D
e
D1 |
A2 A |
b2 L
b3
4 PLCS |
b |
Side View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL |
MIN |
NOM |
MAX |
NOTE |
A |
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0.210 |
2 |
A2 |
0.115 |
0.130 |
0.195 |
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b |
0.014 |
0.018 |
0.022 |
5 |
b2 |
0.045 |
0.060 |
0.070 |
6 |
b3 |
0.030 |
0.039 |
0.045 |
6 |
c |
0.008 |
0.010 |
0.014 |
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D |
0.355 |
0.365 |
0.400 |
3 |
D1 |
0.005 |
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3 |
E |
0.300 |
0.310 |
0.325 |
4 |
E1 |
0.240 |
0.250 |
0.280 |
3 |
e |
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0.100 BSC |
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eA |
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0.300 BSC |
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4 |
L |
0.115 |
0.130 |
0.150 |
2 |
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2.Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3.D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4.E and eA measured with the leads constrained to be perpendicular to datum.
5.Pointed or rounded lead tips are preferred to ease insertion.
6.b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
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01/09/02 |
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2325 Orchard Parkway |
TITLE |
DRAWING NO. |
REV. |
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8P3, 8-lead, 0.300" Wide Body, Plastic Dual |
8P3 |
B |
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R San Jose, CA 95131 |
In-line Package (PDIP) |
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178 ATtiny25/45/85
2586A–AVR–02/05
ATtiny25/45/85
28.28S2
C
1
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End View |
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e |
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b |
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A |
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A1 |
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MAX |
NOTE |
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A |
1.70 |
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2.16 |
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A1 |
0.05 |
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0.25 |
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b |
0.35 |
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0.48 |
5 |
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C |
0.15 |
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0.35 |
5 |
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D |
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D |
5.13 |
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5.35 |
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E1 |
5.18 |
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5.40 |
2, 3 |
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Side View |
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E |
7.70 |
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8.26 |
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L |
0.51 |
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0.85 |
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0˚ |
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8˚ |
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e |
1.27 BSC |
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4 |
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Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2.Mismatch of the upper and lower dies and resin burrs are not included.
3.It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4.Determines the true geometric position.
5.Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/−0.005 mm.
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|
|
10/7/03 |
|
2325 Orchard Parkway |
TITLE |
DRAWING NO. |
REV. |
|
8S2, 8-lead, 0.209" Body, Plastic Small |
8S2 |
C |
||
R San Jose, CA 95131 |
Outline Package (EIAJ) |
|||
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|
179
2586A–AVR–02/05